Inventor
HUR KANG HEON
KR68 patents
⚠️ This page may combine multiple inventors who share the name “HUR KANG HEON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
32 patentsUS6980413B1Dec 27, 2005
Thin film multi-layered ceramic capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH21 citations92
US6917513B1Jul 12, 2005
Non reducible dielectric ceramic composition and super-thin multi-layer ceramic capacitor using the same
SAMSUNG ELECTRO MECH52 citations92
US6777363B2Aug 17, 2004
Non-reducable, low temperature dielectric ceramic composition, capacitor and method of preparing
SAMSUNG ELECTRO MECH21 citations92
US6692721B2Feb 17, 2004
Method for preparing barium titanate powder by oxalate synthesis
SAMSUNG ELECTRO MECH31 citations90
US6649554B1Nov 18, 2003
Dielectric composition having increased homogeneity and insulation resistance, method of preparing the same and multi-layer ceramic capacitor using the same
SAMSUNG ELECTRO MECH26 citations89
US10256200B2Apr 9, 2019
Electronic component package and method of manufacturing the same
SAMSUNG ELECTRO MECH7 citations84
US10199337B2Feb 5, 2019
Electronic component package and method of manufacturing the same
SAMSUNG ELECTRO MECH9 citations84
US9984979B2May 29, 2018
Fan-out semiconductor package and method of manufacturing the same
SAMSUNG ELECTRO MECH10 citations84
US6876538B1Apr 5, 2005
Dielectric composition for multilayer ceramic capacitor, multilayer ceramic capacitor, and method for manufacturing multilayer ceramic capacitor
SAMSUNG ELECTRO MECH13 citations84
US6740614B2May 25, 2004
Dielectric ceramic composition
SAMSUNG ELECTRO MECH16 citations84
US7851393B2Dec 14, 2010
Glass composition for low temperature sintering, glass frit, dielectric composition and multilayer ceramic capacitor using the same
SAMSUNG ELECTRO MECH8 citations82
US7691762B2Apr 6, 2010
Glass composition for low temperature sintering, glass frit, dielectric composition and multilayer ceramic capacitor using the same
SAMSUNG ELECTRO MECH9 citations82
US7567428B2Jul 28, 2009
Dielectric ceramic composition for low-temperature sintering and hot insulation resistance and multilayer ceramic capacitor using the same
SAMSUNG ELECTRO MECH8 citations82
US10262949B2Apr 16, 2019
Fan-out semiconductor package and method of manufacturing the same
SAMSUNG ELECTRO MECH4 citations73
US9991744B2Jun 5, 2018
Wireless power receiving device and apparatus including the same
SAMSUNG ELECTRO MECH5 citations73
US9520223B2Dec 13, 2016
Inductor and method for manufacturing the same
SAMSUNG ELECTRO MECH3 citations73
US9472608B2Oct 18, 2016
Chip inductor
SAMSUNG ELECTRO MECH5 citations73
US9236173B2Jan 12, 2016
Coil parts and method of manufacturing the same
SAMSUNG ELECTRO MECH4 citations73
US9183979B2Nov 10, 2015
Chip inductor and method for manufacturing the same
SAMSUNG ELECTRO MECH4 citations73
US9105378B2Aug 11, 2015
Graphene transparent electrode and method for manufacturing the same
SAMSUNG ELECTRO MECH4 citations73
US7605104B2Oct 20, 2009
Glass composition for low temperature sintering, dielectric composition and multilayer ceramic capacitor using the same
SAMSUNG ELECTRO MECH7 citations72
US6733897B2May 11, 2004
Dielectric composition and multilayer ceramic condenser using the same
SAMSUNG ELECTRO MECH11 citations72
US6641794B2Nov 4, 2003
Method for producing barium titanate based powders by oxalate process
SAMSUNG ELECTRO MECH10 citations71
US6849567B2Feb 1, 2005
Low temperature sinterable dielectric ceramic composition and multilayer ceramic chip capacitor using the same
SAMSUNG ELECTRO MECH4 citations63
US6740613B2May 25, 2004
Dielectric ceramic composition
SAMSUNG ELECTRO MECH6 citations63
US8981889B2Mar 17, 2015
Common mode filter with ESD protection pattern built therein
SAMSUNG ELECTRO MECH3 citations62
US8369065B2Feb 5, 2013
Electric double layer capacitor
SAMSUNG ELECTRO MECH3 citations61
US7336476B2Feb 26, 2008
Dielectric ceramic composition for low temperature sintering and multilayer ceramic capacitor using the same
SAMSUNG ELECTRO MECH5 citations61
US7179441B2Feb 20, 2007
Method for preparing barium-titanate based powder
SAMSUNG ELECTRO MECH6 citations60
US7147835B2Dec 12, 2006
Oxide powder for dielectrics, method of manufacturing oxide powder for dielectrics, and multi-layer ceramic capacitor using the same
SAMSUNG ELECTRO MECH4 citations60
US9105844B2Aug 11, 2015
Piezoelectric device with piezoelectric polymer material
SAMSUNG ELECTRO MECH2 citations57
US10580576B2Mar 3, 2020
Dielectric powder and multilayer ceramic electronic component using the same
SAMSUNG ELECTRO MECH0 citations52
SAMSUNG ELECTRONICS CO LTD
4 patentsUS10672719B2Jun 2, 2020
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations73
US10373884B2Aug 6, 2019
Fan-out semiconductor package for packaging semiconductor chip and capacitors
SAMSUNG ELECTRONICS CO LTD1 citations63
US10714440B2Jul 14, 2020
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations52
US10403588B2Sep 3, 2019
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations52
KANG SUNG HYUNG
2 patentsHUR KANG HEON
2 patentsSEO DONG HWAN
1 patentYOON SEOK HYUN
1 patentYOO YOUNG SEUCK
1 patentSAMSUNG ELECTR MECHANICS CO LT
1 patentCHANG DONG IK
1 patentSOHN SUNG BUM
1 patentSONG SOON MO
1 patentCHUNG HAE SUK
1 patentCERA CO LTD S
1 patentWITS CO LTD
1 patentShowing the top 50 of 68 patents by PatentIndex Score.