Inventor

JAO SHENG HUANG

TW2 patents

⚠️ This page may combine multiple inventors who share the name “JAO SHENG HUANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG

1 patent

US7932608B2Apr 26, 2011

Through-silicon via formed with a post passivation interconnect structure

TAIWAN SEMICONDUCTOR MFG52 citations92

TSENG MING-HONG

1 patent

US8390125B2Mar 5, 2013

Through-silicon via formed with a post passivation interconnect structure

TSENG MING-HONG39 citations87