Inventor
GORCZYCA THOMAS BERT
US41 patents
⚠️ This page may combine multiple inventors who share the name “GORCZYCA THOMAS BERT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GEN ELECTRIC
28 patentsUS6396153B2May 28, 2002
Circuit chip package and fabrication method
GEN ELECTRIC163 citations99
US6242282B1Jun 5, 2001
Circuit chip package and fabrication method
GEN ELECTRIC198 citations99
US5703400ADec 30, 1997
Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers
GEN ELECTRIC212 citations99
US6800373B2Oct 5, 2004
Epoxy resin compositions, solid state devices encapsulated therewith and method
GEN ELECTRIC101 citations98
US6368410B1Apr 9, 2002
Semiconductor processing article
GEN ELECTRIC82 citations95
US6303193B1Oct 16, 2001
Process for fabricating a tool used in electrochemical machining
GEN ELECTRIC30 citations93
US7776236B2Aug 17, 2010
Index contrast enhanced optical waveguides and fabrication methods
GEN ELECTRIC34 citations92
US7400809B2Jul 15, 2008
Optical waveguide devices and method of making the same
GEN ELECTRIC33 citations92
US7018572B2Mar 28, 2006
Method for producing data storage media
GEN ELECTRIC21 citations92
US6935792B2Aug 30, 2005
Optoelectronic package and fabrication method
GEN ELECTRIC21 citations92
US6533968B1Mar 18, 2003
Structure and method for molding optical disks
GEN ELECTRIC15 citations92
US6977057B2Dec 20, 2005
Embossing process
GEN ELECTRIC24 citations90
US6548189B1Apr 15, 2003
Epoxy adhesive
GEN ELECTRIC48 citations89
US6504233B1Jan 7, 2003
Semiconductor processing component
GEN ELECTRIC18 citations89
US6067931AMay 30, 2000
Thermal processor for semiconductor wafers
GEN ELECTRIC26 citations87
US6302987B1Oct 16, 2001
High voltage polymer processing methods and power feed-through bushing applications
GEN ELECTRIC15 citations83
US6146558ANov 14, 2000
Structure and method for molding optical disks
GEN ELECTRIC15 citations82
US9929319B2Mar 27, 2018
LED package with red-emitting phosphors
GEN ELECTRIC4 citations73
US6787071B2Sep 7, 2004
Method and apparatus for producing data storage media
GEN ELECTRIC10 citations73
US6508961B1Jan 21, 2003
Structure and method for molding optical disks
GEN ELECTRIC8 citations73
US6706205B2Mar 16, 2004
Semiconductor processing article
GEN ELECTRIC7 citations71
US7018580B2Mar 28, 2006
Method and apparatus for forming tapered waveguide structures
GEN ELECTRIC6 citations60
US6709608B2Mar 23, 2004
Semiconductor processing component
GEN ELECTRIC3 citations59
US8629003B2Jan 14, 2014
Epoxy encapsulating and lamination adhesive and method of making same
GEN ELECTRIC0 citations52
US7742672B2Jun 22, 2010
Composition, optical device article, and associated method
GEN ELECTRIC0 citations52
US7541391B2Jun 2, 2009
Self-forming polymer waveguide and waveguide material with reduced shrinkage
GEN ELECTRIC1 citations52
US7956457B2Jun 7, 2011
System and apparatus for venting electronic packages and method of making same
GEN ELECTRIC1 citations48
US10573722B2Feb 25, 2020
Systems and methods for in-situ doped semiconductor gate electrodes for wide bandgap semiconductor power devices
GEN ELECTRIC0 citations42
LOCKHEED CORP
4 patentsUS6284564B1Sep 4, 2001
HDI chip attachment method for reduced processing
LOCKHEED CORP71 citations96
US6602739B1Aug 5, 2003
Method for making multichip module substrates by encapsulating electrical conductors and filling gaps
LOCKHEED CORP25 citations93
US6255137B1Jul 3, 2001
Method for making air pockets in an HDI context
LOCKHEED CORP36 citations92
US6706624B1Mar 16, 2004
Method for making multichip module substrates by encapsulating electrical conductors
LOCKHEED CORP11 citations74
GORCZYCA THOMAS BERT
3 patentsUS8431444B2Apr 30, 2013
Epoxy encapsulating and lamination adhesive and method of making same
GORCZYCA THOMAS BERT2 citations61
US8427845B2Apr 23, 2013
Electrical connectors for optoelectronic device packaging
GORCZYCA THOMAS BERT2 citations59
US10276486B2Apr 30, 2019
Stress resistant micro-via structure for flexible circuits
GORCZYCA THOMAS BERT0 citations39
KIM TAE WON
2 patentsBEAUPRE RICHARD ALFRED
2 patentsUS8586421B2Nov 19, 2013
Method of forming semiconductor device package having high breakdown voltage and low parasitic inductance
BEAUPRE RICHARD ALFRED3 citations62
US8310040B2Nov 13, 2012
Semiconductor device package having high breakdown voltage and low parasitic inductance and method of manufacturing thereof
BEAUPRE RICHARD ALFRED4 citations62