Inventor
SUN YU H
US6 patents
Patents
6 patentsUS6586828B2Jul 1, 2003
Integrated circuit bus grid having wires with pre-selected variable widths
IBM21 citations91
US6584596B2Jun 24, 2003
Method of designing a voltage partitioned solder-bump package
IBM35 citations91
US6538314B1Mar 25, 2003
Power grid wiring for semiconductor devices having voltage islands
IBM23 citations91
US6523150B1Feb 18, 2003
Method of designing a voltage partitioned wirebond package
IBM50 citations91
US7064570B2Jun 20, 2006
Method for locating IDDQ defects using multiple controlled collapse chip connections current measurement on an automatic tester
IBM5 citations72
US6677774B2Jan 13, 2004
Method for locating IDDQ defects using multiple controlled collapse chip connections current measurement on an automatic tester
IBM8 citations72