Inventor
ROUHANA LAYAL
US4 patents
Patents
4 patentsUS9496213B2Nov 15, 2016
Integrated device package comprising a magnetic core inductor with protective ring embedded in a package substrate
QUALCOMM INC11 citations82
US10157824B2Dec 18, 2018
Integrated circuit (IC) package and package substrate comprising stacked vias
QUALCOMM INC3 citations68
US9355898B2May 31, 2016
Package on package (PoP) integrated device comprising a plurality of solder resist layers
QUALCOMM INC2 citations60
US10651160B2May 12, 2020
Low profile integrated package
QUALCOMM INC0 citations46