Inventor

QUEVY EMMANUEL P

US51 patents

⚠️ This page may combine multiple inventors who share the name “QUEVY EMMANUEL P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

QUEVY EMMANUEL P

QUEVY EMMANUEL P

Planar microshells for vacuum encapsulated devices and damascene method of manufacture

Microshells with integrated getter layer

MEMS-based magnetic sensor with a Lorentz force actuator used as force feedback

Planar microshells for vacuum encapsulated devices and damascene method of manufacture

Dual in-situ mixing for extended tuning range of resonators

Out-of-plane MEMS resonator with static out-of-plane deflection

Technique for forming a MEMS device

Technique for forming a MEMS device using island structures

Method for temperature compensation in MEMS resonators with isolated regions of distinct material

Temperature compensated oscillator including MEMS resonator for frequency control

Highly accurate temperature stable clock based on differential frequency discrimination of oscillators

Out-of plane MEMS resonator with static out-of-plane deflection

MEMS coupler and method to form the same

Method for temperature compensation in MEMS resonators with isolated regions of distinct material

Dual in-situ mixing for extended tuning range of resonators

Switchable electrode for power handling

SILICON LAB INC

Planar microshells for vacuum encapsulated devices and damascene method of manufacture

Encapsulated MEMS device and method to form the same

Out-of plane MEMS resonator with static out-of-plane deflection

Hybrid system having a non-MEMS device and a MEMS device

Compensation of changes in MEMS capacitive transduction

Temperature compensation for MEMS devices

Monolithic body MEMS devices

Suspended passive element for MEMS devices

Gas-diffusion barriers for MEMS encapsulation

Integrated MEMS design for manufacturing

Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)

Technique for forming a MEMS device

SILICON CLOCKS INC

Method for temperature compensation in MEMS resonators with isolated regions of distinct material

Microshells for multi-level vacuum cavities

Low stress thin film microshells

IC-compatible MEMS structure

Thin film microshells incorporating a getter layer

MEMS structure having a compensated resonating member

MEMS structure having a stress inverter temperature-compensated resonating member

SEMICONDUCTOR MFG INT SHANGHAI CORP

Method for temperature compensation in MEMS resonators with isolated regions of distinct material

Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulation

Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)

Membrane transducer structures and methods of manufacturing same using thin-film encapsulation

Membrane transducer structures and methods of manufacturing same using thin-film encapsulation

UNIV CALIFORNIA

Temperature compensated oscillator including MEMS resonator for frequency control

Damascene process for use in fabricating semiconductor structures having micro/nano gaps

SILICON LAB

Highly accurate temperature stable clock based on differential frequency discrimination of oscillators

MEMS structure having a stress inverter temperature-compensated resonator member

SILICON LABS SC INC

MEMS coupler and method to form the same

Method to form a MEMS structure having a suspended portion

MCCRAITH ANDREW D

Hybrid system having a non-MEMS device and a MEMS device

Hybrid system having a non-MEMS device and a MEMS device

TAKEUCHI HIDEKI

Damascene process for use in fabricating semiconductor structures having micro/nano gaps

MOTIEE MEHRNAZ

Out-of-plane resonator