Inventor

OGAWA HIROYUKI

JP251 patents

⚠️ This page may combine multiple inventors who share the name “OGAWA HIROYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OGAWA HIROYUKI

SANDISK TECHNOLOGIES LLC

Through-memory-level via structures for a three-dimensional memory device

Mid-plane word line switch connection for CMOS under three-dimensional memory device and method of making thereof

Through-memory-level via structures for a three-dimensional memory device

Through-memory-level via structures for a three-dimensional memory device

Through-memory-level via structures for a three-dimensional memory device

Bulb-shaped memory stack structures for direct source contact in three-dimensional memory device

Bulb-shaped memory stack structures for direct source contact in three-dimensional memory device

Multi-tier three-dimensional memory devices containing annular dielectric spacers within memory openings and methods of making the same

Bulb-shaped memory stack structures for direct source contact in three-dimensional memory device

Three-dimensional memory device having passive devices at a buried source line level and method of making thereof

Through-memory-level via structures for a three-dimensional memory device

Three-dimensional memory device including stepped connection plates and methods of forming the same

Multi-tier memory device with through-stack peripheral contact via structures and method of making thereof

Through-memory-level via structures between staircase regions in a three-dimensional memory device and method of making thereof

Within-array through-memory-level via structures and method of making thereof

Split memory cells with unsplit select gates in a three-dimensional memory device

Three-dimensional memory device having non-uniform spacing among memory stack structures and method of making thereof

Three-dimensional memory device with horizontal silicon channels and method of making the same

Bulb-shaped memory stack structures for direct source contact in three-dimensional memory device

CMOS devices containing asymmetric contact via structures and method of making the same

Three-dimensional memory device having conductive support structures and method of making thereof

Three-dimensional memory device having passive devices at a buried source line level and method of making thereof

Transistors having semiconductor-metal composite gate electrodes containing different thickness interfacial dielectrics and methods of making thereof

Method of operating memory array having divided apart bit lines and partially divided bit line selector switches

SANDISK TECHNOLOGIES INC

Word line decoder circuitry under a three-dimensional memory array

Integration of word line switches with word line contact via structures

Three dimensional NAND device with channel located on three sides of lower select gate and method of making thereof

Three dimensional memory device having well contact pillar and method of making thereof

Multilevel interconnect structure and methods of manufacturing the same

Vertical resistor in 3D memory device with two-tier stack

Method of making a monolithic three dimensional NAND string using a select gate etch stop layer

Bottom recess process for an outer blocking dielectric layer inside a memory opening

Three-dimensional memory devices having a single layer channel and methods of making thereof

SEMICONDUCTOR ENERGY LAB

Electro-optical devices in which pixel section and the driver circuit are disposed over the same substrate

Semiconductor device

Semiconductor device having a tantalum oxide blocking film

Semiconductor device and the fabricating method therefor

OGAWA HIROYUKI

Power transmission device

Method for observing object by projection, method for detecting microorganisms and projection detecting system

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Plasma surface treating method

Combination optical data medium with multiple data surfaces and cassette therefor

NIPPON STEEL CORP

Oil Country Tubular Goods or a line pipe formed of a high-strength martensitic stainless steel

Martensitic stainless steels excellent in corrosion resistance and stress corrosion cracking resistance and method of heat treatment of the steels

ADVANCED MICRO DEVICES INC

Die seal for semiconductor device moisture protection

MURAKAMI AKIRA

Engine start control device of hybrid vehicle

SHIINA TAKAHIRO

Continuously variable transmission

TOYOTA MOTOR CO LTD

Continuously variable transmission

ADV LCD TECH DEV CT CO LTD

Semiconductor device, annealing method, annealing apparatus and display apparatus

SPANSION LLC

Method and system for tailoring core and periphery cells in a nonvolatile memory

SHARP KK

Method for fabricating semiconductor device