Inventor
TAN KELVIN AIK BOO
SG5 patents
Patents
5 patentsUS12593706B2Mar 31, 2026
Multi-chip package with enhanced conductive layer adhesion
MICRON TECHNOLOGY INC0 citations60
US12588527B2Mar 24, 2026
Dielectric interposer with electrical-connection cut-in
MICRON TECHNOLOGY INC0 citations60
US12476216B2Nov 18, 2025
Wire bonding for stacked memory dies
MICRON TECHNOLOGY INC0 citations60
US12463140B2Nov 4, 2025
Flexible interposer for semiconductor dies
MICRON TECHNOLOGY INC0 citations60
US12500186B2Dec 16, 2025
Capacitor having electrodes formed within a substrate
MICRON TECHNOLOGY INC0 citations51