Inventor

SCHOLZ WOLFGANG A

DE4 patents

⚠️ This page may combine multiple inventors who share the name “SCHOLZ WOLFGANG A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

3 patents

US7543373B2Jun 9, 2009

Gel package structural enhancement of compression system board connections

IBM10 citations80

US7344919B2Mar 18, 2008

Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener

IBM15 citations80

US7930820B2Apr 26, 2011

Method for structural enhancement of compression system board connections

IBM5 citations59

MCALLISTER MICHAEL F

1 patent

US8929086B2Jan 6, 2015

Gel package structural enhancement of compression system board connections

MCALLISTER MICHAEL F0 citations42