Inventor
LEE SEUNG-JAE
KR315 patents
⚠️ This page may combine multiple inventors who share the name “LEE SEUNG-JAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
22 patentsUS7890818B2Feb 15, 2011
Read level control apparatuses and methods
SAMSUNG ELECTRONICS CO LTD122 citations99
US7903467B2Mar 8, 2011
Programming method of multi-bit flash memory device for reducing programming error
SAMSUNG ELECTRONICS CO LTD23 citations93
US7876614B2Jan 25, 2011
Multi-bit flash memory device and program and read methods thereof
SAMSUNG ELECTRONICS CO LTD19 citations93
US7566927B2Jul 28, 2009
Flash memory device
SAMSUNG ELECTRONICS CO LTD36 citations93
US7545677B2Jun 9, 2009
Nonvolatile memory device and methods of programming and reading the same
SAMSUNG ELECTRONICS CO LTD41 citations93
US7457158B2Nov 25, 2008
Flash memory device having single page buffer structure and related programming operations
SAMSUNG ELECTRONICS CO LTD27 citations93
US7227782B2Jun 5, 2007
NAND flash memory device capable of improving read speed
SAMSUNG ELECTRONICS CO LTD22 citations93
US7176747B2Feb 13, 2007
Multi-level high voltage generator
SAMSUNG ELECTRONICS CO LTD21 citations93
US6975547B2Dec 13, 2005
Flash memory devices that support efficient memory locking operations and methods of operating flash memory devices
SAMSUNG ELECTRONICS CO LTD20 citations93
US6678191B2Jan 13, 2004
Semiconductor memory device having memory cell arrays capable of accomplishing random access
SAMSUNG ELECTRONICS CO LTD52 citations93
US7163869B2Jan 16, 2007
Shallow trench isolation structure with converted liner layer
SAMSUNG ELECTRONICS CO LTD50 citations92
US7125774B2Oct 24, 2006
Method of manufacturing transistor having recessed channel
SAMSUNG ELECTRONICS CO LTD28 citations92
US6629787B2Oct 7, 2003
Apparatus and method for adjusting a head gap of an inkjet printer
SAMSUNG ELECTRONICS CO LTD45 citations91
US9536735B2Jan 3, 2017
Method for preparing graphene
SAMSUNG ELECTRONICS CO LTD10 citations84
US7920420B2Apr 5, 2011
Multi bit flash memory device and method of programming the same
SAMSUNG ELECTRONICS CO LTD14 citations84
US7898853B2Mar 1, 2011
Multi-bit data memory system and read operation
SAMSUNG ELECTRONICS CO LTD7 citations84
US7791938B2Sep 7, 2010
MSB-based error correction for flash memory system
SAMSUNG ELECTRONICS CO LTD10 citations84
US7663914B2Feb 16, 2010
Method of programming a multi bit flash memory device to avoid programming errors and a device implementing the same
SAMSUNG ELECTRONICS CO LTD15 citations84
US7495968B2Feb 24, 2009
Wired-or typed page buffer having cache function in a nonvolatile memory device and related method of programming
SAMSUNG ELECTRONICS CO LTD8 citations84
US6669191B2Dec 30, 2003
Sheet delivery and position controlling apparatus for a printer
SAMSUNG ELECTRONICS CO LTD13 citations84
US11120714B2Sep 14, 2021
Circuit for detecting crack in display and electronic device including same
SAMSUNG ELECTRONICS CO LTD14 citations82
US10566326B2Feb 18, 2020
Semiconductor devices including a device isolation region in a substrate and/or fin
SAMSUNG ELECTRONICS CO LTD7 citations82
AMKOR TECHNOLOGY INC
9 patentsUS9214434B1Dec 15, 2015
Fan-out semiconductor package
AMKOR TECHNOLOGY INC55 citations98
US9831282B2Nov 28, 2017
Electronic device package and fabricating method thereof
AMKOR TECHNOLOGY INC9 citations92
US9129873B2Sep 8, 2015
Package of finger print sensor and fabricating method thereof
AMKOR TECHNOLOGY INC10 citations92
US8946883B2Feb 3, 2015
Wafer level fan-out package with a fiducial die
AMKOR TECHNOLOGY INC23 citations92
US10692918B2Jun 23, 2020
Electronic device package and fabricating method thereof
AMKOR TECHNOLOGY INC3 citations84
US10535536B2Jan 14, 2020
Stiffener package and method of fabricating stiffener package
AMKOR TECHNOLOGY INC4 citations84
US10304890B2May 28, 2019
Electronic device package and fabricating method thereof
AMKOR TECHNOLOGY INC5 citations84
US10224217B1Mar 5, 2019
Wafer level fan out package and method of fabricating wafer level fan out package
AMKOR TECHNOLOGY INC7 citations84
US9431447B2Aug 30, 2016
Package of finger print sensor and fabricating method thereof
AMKOR TECHNOLOGY INC8 citations84
LEE SEUNG-JAE
5 patentsUS8489606B2Jul 16, 2013
Music search apparatus and method using emotion model
LEE SEUNG-JAE30 citations92
US8205071B2Jun 19, 2012
Method for moving rights objects into other device in digital rights management
LEE SEUNG-JAE9 citations84
US8161103B2Apr 17, 2012
Method for supporting post browsing in moving rights object of digital rights management and terminal thereof
LEE SEUNG-JAE6 citations84
US8432741B2Apr 30, 2013
Nonvolatile memory device and nonvolatile memory system employing same
LEE SEUNG-JAE13 citations83
US8154927B2Apr 10, 2012
Nonvolatile memory device and nonvolatile memory system employing same
LEE SEUNG-JAE10 citations83
LEE SEUNG JAE
2 patentsKONG JUN JIN
2 patentsKIM JIN YOUNG
1 patentLG ELECTRONICS INC
1 patentLEE JUNG-CHAN
1 patentKIM SANG WON
1 patentAMKOR TECH SINGAPORE HOLDING PTE LTD
1 patentKIM YU-SIK
1 patentSAMSUNG DISPLAY CO LTD
1 patentYUN EUN-JIN
1 patentNEW MOTECH CO LTD
1 patentLEE DOO-HWAN
1 patentShowing the top 50 of 315 patents by PatentIndex Score.