P

Inventor

Feng li-wei

TW96 patents
⚠️ This page may combine multiple inventors who share the name “Feng li-wei”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

44 patents
US9530778B1Dec 27, 2016

Semiconductor devices having metal gate and method for manufacturing semiconductor devices having metal gate

UNITED MICROELECTRONICS CORP40 citations94
US9123659B1Sep 1, 2015

Method for manufacturing finFET device

UNITED MICROELECTRONICS CORP30 citations94
US10074656B1Sep 11, 2018

Semiconductor memory device and manufacturing method thereof

UNITED MICROELECTRONICS CORP19 citations93
US10600790B2Mar 24, 2020

Manufacturing method of semiconductor memory device

UNITED MICROELECTRONICS CORP6 citations84
US10079277B2Sep 18, 2018

Method of fabricating metal-insulator-metal capacitor

UNITED MICROELECTRONICS CORP9 citations84
US10068907B1Sep 4, 2018

Dynamic random access memory

UNITED MICROELECTRONICS CORP10 citations84
US9960167B1May 1, 2018

Method for forming semiconductor device

UNITED MICROELECTRONICS CORP7 citations84
US9929162B1Mar 27, 2018

Semiconductor device and method for forming the same

UNITED MICROELECTRONICS CORP9 citations84
US9859283B1Jan 2, 2018

Semiconductor memory structure

UNITED MICROELECTRONICS CORP10 citations84
US9704737B2Jul 11, 2017

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP10 citations84
US9559164B2Jan 31, 2017

Nanowire transistor device and method for manufacturing nanowire transistor device

UNITED MICROELECTRONICS CORP9 citations84
US9552978B1Jan 24, 2017

Method of decreasing fin bending

UNITED MICROELECTRONICS CORP11 citations84
US9502410B1Nov 22, 2016

Semiconductor structure and manufacturing method thereof

UNITED MICROELECTRONICS CORP13 citations84
US9484263B1Nov 1, 2016

Method of removing a hard mask on a gate

UNITED MICROELECTRONICS CORP8 citations84
US9455194B1Sep 27, 2016

Method for fabricating semiconductor device

UNITED MICROELECTRONICS CORP7 citations84
US10978457B2Apr 13, 2021

Semiconductor device and manufacturing method thereof

UNITED MICROELECTRONICS CORP4 citations73
US10643997B2May 5, 2020

Semiconductor device with metal gates

UNITED MICROELECTRONICS CORP2 citations73
US10396073B2Aug 27, 2019

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP2 citations73
US10170481B2Jan 1, 2019

Semiconductor memory device and method of forming the same

UNITED MICROELECTRONICS CORP2 citations73
US10056467B2Aug 21, 2018

Semiconductor fin structure and method of forming the same

UNITED MICROELECTRONICS CORP2 citations73
US9985035B1May 29, 2018

Semiconductor memory structure

UNITED MICROELECTRONICS CORP4 citations73
US9947792B2Apr 17, 2018

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP3 citations73
US9773887B2Sep 26, 2017

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP3 citations73
US9754938B1Sep 5, 2017

Semiconductor device and method of fabricating the same

UNITED MICROELECTRONICS CORP3 citations73
US9653290B2May 16, 2017

Method for manufacturing nanowire transistor device

UNITED MICROELECTRONICS CORP3 citations73
US9627268B2Apr 18, 2017

Method for fabricating semiconductor device

UNITED MICROELECTRONICS CORP5 citations73
US9508715B1Nov 29, 2016

Semiconductor structure

UNITED MICROELECTRONICS CORP3 citations73
US9384978B1Jul 5, 2016

Method of forming trenches

UNITED MICROELECTRONICS CORP3 citations73
US11508614B2Nov 22, 2022

Method of forming semiconductor device having capped air gaps between buried bit lines and buried gate

UNITED MICROELECTRONICS CORP2 citations72
US10854676B2Dec 1, 2020

Semiconductor device having capped air caps between buried bit lines and buried gate

UNITED MICROELECTRONICS CORP4 citations72
US10672864B2Jun 2, 2020

Manufacturing method of semiconductor memory device

UNITED MICROELECTRONICS CORP2 citations72
US10546861B2Jan 28, 2020

Semiconductor device for avoiding short circuit between adjacent storage nodes and manufacturing method thereof

UNITED MICROELECTRONICS CORP4 citations72
US10361209B2Jul 23, 2019

Semiconductor memory device

UNITED MICROELECTRONICS CORP4 citations72
US10276650B2Apr 30, 2019

Semiconductor memory device and manufacturing method thereof

UNITED MICROELECTRONICS CORP2 citations72
US10181473B2Jan 15, 2019

Semiconductor device

UNITED MICROELECTRONICS CORP4 citations72
US9653603B1May 16, 2017

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP2 citations72
US11233057B2Jan 25, 2022

Semiconductor structure and fabrication method thereof

UNITED MICROELECTRONICS CORP2 citations71
US11049863B2Jun 29, 2021

Semiconductor structure with capacitor landing pad and method of making the same

UNITED MICROELECTRONICS CORP3 citations71
US10529719B2Jan 7, 2020

Semiconductor structure and fabrication method thereof

UNITED MICROELECTRONICS CORP2 citations71
US10290736B2May 14, 2019

Semiconductor device and method of forming the same

UNITED MICROELECTRONICS CORP2 citations71
US10169521B2Jan 1, 2019

Method for forming contact plug layout

UNITED MICROELECTRONICS CORP3 citations69
US11271000B2Mar 8, 2022

Method for fabricating semiconductor device

UNITED MICROELECTRONICS CORP2 citations64
US11121136B2Sep 14, 2021

Insulating structure and method of forming the same

UNITED MICROELECTRONICS CORP0 citations63
US11069689B2Jul 20, 2021

Manufacturing method of semiconductor memory device

UNITED MICROELECTRONICS CORP0 citations63

FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD

6 patents

Showing the top 50 of 96 patents by PatentIndex Score.