Inventor

CUNNINGHAM JOHN E

US120 patents

⚠️ This page may combine multiple inventors who share the name “CUNNINGHAM JOHN E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CUNNINGHAM JOHN E

ORACLE INT CORP

Hybrid-integrated photonic chip package

Packaged opto-electronic module

Hybrid-integrated photonic chip package with an interposer

Temperature-insensitive optical component

Hybrid-integrated photonic chip package with an interposer

Integrated electro-absorption modulator

Hybrid integrated photonic chip package

Surface-normal coupler for silicon-on-insulator platforms

Enhanced optical modulation using slow light

Integrated electro-absorption modulator

Vertical integration of a hybrid optical source

Hybrid optical source with semiconductor reflector

ORACLE AMERICA INC

Multi-chip system including capacitively coupled and optical communication

Optical-signal-path routing in a multi-chip system

Low-latency switch using optical and electrical proximity communication

Multi-chip systems using on-chip photonics

Misalignment compensation for proximity communication

Integrated-circuit package for proximity communication

Multi-chip systems with optical bypass

Optical device with large thermal impedance

SUN MICROSYSTEMS INC

Transparent switch using optical and electrical proximity communication

Method and apparatus for coupling optical signals onto a semiconductor chip

Integrated ring modulator array WDM transceiver

Clocking of integrated circuits using photonics

Method and apparatus for facilitating proximity communication and power delivery

Optical imaging device for optical proximity communication

LUCENT TECHNOLOGIES INC

Vertical cavity surface emitting laser (VCSEL)

Accurate in-situ lattice matching by reflection high energy electron diffraction

Optoelectronic devices utilizing multiple quantum well pin structures

THACKER HIREN D

Maintaining alignment in a multi-chip module using a compressible structure

Direct interlayer optical coupler

Interconnection and assembly of three-dimensional chip packages

LI GUOLIANG

Grating coupler for inter-chip optical coupling

Thermal tuning of an optical device

Dual-layer thermally tuned optical device

AMERICAN TELEPHONE & TELEGRAPH

Field-effect transistor having a delta-doped ohmic contact

Delta-doped ohmic metal to semiconductor contacts

YAO JIN

Three-dimensional macro-chip including optical interconnects

Three-dimensional macro-chip including optical interconnects

RAJ KANNAN

Efficient inter-chip optical coupling

Chip package to support high-frequency processors

AT & T CORP

Surface treatment for silicon substrates

(unassigned)

Apparatus and method for electrolysis to enhance combustion in an internal combustion engine

SHI JING

Mechanical coupling in a multi-chip module using magnetic components

AT & T BELL LAB

Method of making a non-alloyed ohmic contact to III-V semiconductors-on-silicon

Oracle America

Electrical contacts on top of waveguide structures for efficient optical modulation in silicon photonic devices

ASGHARI MEHDI

Edge coupling of optical devices

ALTERNATE FUELS INC

Method and apparatus for enhancing combustion in an internal combustion engine through electrolysis

CHOW EUGENE M

Multi-chip module with multi-level interposer

KRISHNAMOORTHY ASHOK V

Self-assembly of micro-structures