Inventor

SCHRANK FRANZ

AT53 patents

⚠️ This page may combine multiple inventors who share the name “SCHRANK FRANZ”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SCHRANK FRANZ

AMS AG

Optical sensor arrangement and method of producing an optical sensor arrangement

Semiconductor device with through-substrate via covered by a solder ball

Semiconductor sensor device and method of producing a semiconductor sensor device

Semiconductor device comprising an aperture array and method of producing such a semiconductor device

Method of producing a semiconductor device with through-substrate via covered by a solder ball

Semiconductor device with through-substrate via covered by a solder ball and related method of production

Semiconductor device for detection of radiation and method of producing a semiconductor device for detection of radiation

Dicing method

Method for manufacturing a semiconductor device and semiconductor device

Method of producing an interposer-chip-arrangement for dense packaging of chips

Interposer-chip-arrangement for dense packaging of chips

Semiconductor device with integrated hot plate and recessed substrate and method of production

Optoelectronic device with a refractive element and a method of producing such an optoelectronic device

Method of producing a semiconductor device with through-substrate via covered by a solder ball

Semiconductor device for wafer-scale integration

Method of wafer-scale integration of semiconductor devices and semiconductor device

Optical package and method of producing an optical package

Method of forming a through-substrate via and a semiconductor device comprising a through-substrate via

Method of producing an optical sensor at wafer-level and optical sensor

Semiconductor device with through-substrate via

Crack-resistant semiconductor devices

Method for manufacturing an optical sensor and optical sensor

Method of producing a semiconductor device having an interconnect through the substrate

Semiconductor device for optical applications and method of producing such a semiconductor device

SCHRANK FRANZ

Micro electro mechanical system (MEMS) microphone having a thin-film construction

Microphone arrangement and method for production thereof

Optoelectronic components with adhesion agent

Semiconductor component having a plated through-hole and method for the production thereof

Method for producing a semiconductor component, and semiconductor component

EPCOS AG

Method for the manufacture of electrical component

Electric component, method for the production thereof and use of the same

Ceramic component comprising an environmentally stable contact system

Electrical component and method for making the component

Method for making an electrical component

AUSTRIAMICROSYSTEMS AG

Semiconductor substrate with interlayer connection and method for production of a semiconductor substrate with interlayer connection

Component with a semiconductor junction and method for the production thereof

MEMS sensor comprising a deformation-free back electrode

Method for producing a semiconductor component with two trenches

BAUMGARTNER ERWIN

LED module, LED illumination means, and LED lamp for the energy-efficient reproduction of white light

LOEFFLER BERNHARD

Micromechanical component, method for fabrication and use

SIEMENS MATSUSHITA COMPONENTS

Hybrid thermistor temperature sensor

KRAFT JOCHEN

Semiconductor device and a method for making the semiconductor device

LUMITECH PRODUKTION UND ENTW GMBH

LED module, LED illumination means, and LED lamp for the energy-efficient reproduction of white light

TDK ELECTRONICS AG

LED module and use of the LED module

SCIOSENSE BV

Pressure sensor device and method for forming a pressure sensor device

SIEMENS AG

Sintering ceramic for stable high-temperature thermistors and method for producing the same

TEVA JORDI

Photodiode device and method for production thereof

TRIDONIC JENNERSDORF GMBH

LED/LD illumination device with separate luminophore configuration, and method for producing same

MEINHARDT GERALD

Photodiode with integrated semiconductor circuit and method for the production thereof

AMS INT AG

Sensor chip stack and method of producing a sensor chip stack