Inventor

HWANG HEEJUNG

KR3 patents

⚠️ This page may combine multiple inventors who share the name “HWANG HEEJUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

2 patents

US9653373B2May 16, 2017

Semiconductor package including heat spreader and method for manufacturing the same

SAMSUNG ELECTRONICS CO LTD7 citations81

US11502059B2Nov 15, 2022

Semiconductor package including a thermal pillar and heat transfer film

SAMSUNG ELECTRONICS CO LTD1 citations60

KIM JAE CHOON

1 patent

US8692349B2Apr 8, 2014

Semiconductor devices and methods of controlling temperature thereof

KIM JAE CHOON7 citations80