Inventor

SANTOS FERNANDO A

US31 patents

⚠️ This page may combine multiple inventors who share the name “SANTOS FERNANDO A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SANTOS FERNANDO A

NXP USA INC

Molded air cavity packages and methods for the production thereof

Molded air cavity packages and methods for the production thereof

Circuit modules with front-side interposer terminals and through-module thermal dissipation structures

Molded air cavity packages and methods for the production thereof

Molded air cavity packages and methods for the production thereof

Methods of manufacturing packaged electronic devices with top terminations

Leadless power amplifier packages including topside terminations and methods for the fabrication thereof

Method of wafer dicing for wafers with backside metallization and packaged dies

Leadless power amplifier packages including topside termination interposer arrangements and methods for the fabrication thereof

Packaged electronic devices with top terminations

Radio frequency packages containing multilevel power substrates and associated fabrication methods

Methods of fabricating leadless power amplifier packages including topside terminations

Packaged dies with metal outer layers extending from die back sides toward die front sides

Surface-mount amplifier devices

Semiconductor package having an isolation wall to reduce electromagnetic coupling

Semiconductor package having an isolation wall to reduce electromagnetic coupling

Circuit modules with encapsulant-embedded leadframe terminals, and methods of fabricating such circuit modules

FREESCALE SEMICONDUCTOR INC

Semiconductor package having an isolation wall to reduce electromagnetic coupling

Packaged electronic devices with top terminations, and methods of manufacture thereof

Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof

Packaged RF amplifier devices and methods of manufacture thereof

Semiconductor package having an isolation wall to reduce electromagnetic coupling

Method and apparatus for multi-chip structure semiconductor package

Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof

VISWANATHAN LAKSHMINARAYAN

System, method and apparatus for leadless surface mounted semiconductor package

System, method and apparatus for leadless surface mounted semiconductor package

SANCHEZ AUDEL A

Packaged leadless semiconductor device

Packaged leadless semiconductor device

SANTOS FERNANDO A

Method and apparatus for multi-chip structure semiconductor package

Self-defining, low capacitance wire bond pad

JONES JEFFREY K

Wedge bond foot jumper connections