Inventor

SHAH MAHESH K

US21 patents

⚠️ This page may combine multiple inventors who share the name “SHAH MAHESH K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHAH MAHESH K

FREESCALE SEMICONDUCTOR INC

Semiconductor package having an isolation wall to reduce electromagnetic coupling

Semiconductor device with reduced package cross-talk and loss

Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof

Semiconductor package having an isolation wall to reduce electromagnetic coupling

Semiconductor device with a buffer region with tightly-packed filler particles

Plastic packaged device with die interface layer

Chemical die singulation technique

Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof

Semiconductor devices, semiconductor device packages, and packaging techniques for impedance matching and/or low frequency terminations

NXP USA INC

Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof

Microelectronic modules including thermal extension levels and methods for the fabrication thereof

Microelectronic components having integrated heat dissipation posts and systems including the same

Packaged microelectronic component mounting using sinter attachment

High power semiconductor package subsystems

Semiconductor package having an isolation wall to reduce electromagnetic coupling

Semiconductor package having an isolation wall to reduce electromagnetic coupling

Packaged microelectronic component mounting using sinter attachment

MOTOROLA INC

Method for making a sculptured diaphragm

Semiconductor component and method of fabrication

VISWANATHAN LAKSHMINARAYAN

High power semiconductor package subsystems

Solder wettable flanges and devices and systems incorporating solder wettable flanges