Inventor
KAPPAUF DANIEL
DE3 patents
Patents
3 patentsUS12444671B2Oct 14, 2025
Semiconductor component with damped bonding surfaces in a package with encapsulated pins
SIEMENS AG0 citations53
US11832425B2Nov 28, 2023
Support for electric components
SIEMENS AG0 citations53
US11915990B2Feb 27, 2024
Method for manufacturing a power module unit
SIEMENS AG0 citations50