P

Inventor

NAKANO MASAHIRO

JP55 patents
⚠️ This page may combine multiple inventors who share the name “NAKANO MASAHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TDK CORP

16 patents
US6580198B2Jun 17, 2003

Surface acoustic wave device having a thin metal oxide film fully covering at least the electrodes and method of fabricating same

TDK CORP35 citations92
US6407486B1Jun 18, 2002

Surface acoustic wave device

TDK CORP34 citations92
US6316860B1Nov 13, 2001

Surface acoustic wave device, and its fabrication process

TDK CORP29 citations92
US5929723AJul 27, 1999

Surface acoustic wave apparatus having an electrode that is a doped alloy film

TDK CORP34 citations91
US7304377B2Dec 4, 2007

Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device

TDK CORP13 citations84
US5557313ASep 17, 1996

Wear-resistant protective film for thermal head and method of producing the same

TDK CORP13 citations80
US7151310B2Dec 19, 2006

Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device

TDK CORP7 citations74
US7102461B2Sep 5, 2006

Surface acoustic wave element, surface acoustic wave device, surface acoustic wave duplexer, and method of manufacturing surface acoustic wave element

TDK CORP8 citations74
US7467447B2Dec 23, 2008

Method of manufacturing a SAW device

TDK CORP5 citations73
US6903488B2Jun 7, 2005

SAW device and manufacturing method

TDK CORP6 citations73
US5428373AJun 27, 1995

Thermal head for thermal recording or thermal transfer recording and method of manufacturing the same

TDK CORP8 citations67
US6946772B2Sep 20, 2005

Saw element, saw device and branching filter

TDK CORP4 citations63
US7132310B2Nov 7, 2006

Packaging substrate and manufacturing method thereof, integrated circuit device and manufacturing method thereof, and SAW device

TDK CORP2 citations62
US5590969AJan 7, 1997

Wear-resistant protective film for thermal printing heads

TDK CORP5 citations61
US7352114B2Apr 1, 2008

Surface acoustic wave element, surface acoustic wave device, surface acoustic wave duplexer, and method of manufacturing surface acoustic wave element

TDK CORP3 citations60
US7015556B2Mar 21, 2006

Packaging substrate and manufacturing method thereof, integrated circuit device and manufacturing method thereof, and saw device

TDK CORP0 citations52

SONY CORP

3 patents

HITACHI LTD

3 patents

NAKANO MASAHIRO

3 patents

SHARP KK

3 patents

PANASONIC IP MAN CO LTD

3 patents

TSURUMOTO TAKASHI

2 patents

SUNTORY FLOWERS LTD

2 patents

ALZA CORP

1 patent

ASAHI DIAMOND IND

1 patent

OBA HARUO

1 patent

TAKASAGO MED IND

1 patent

KONDO KAZUMOTO

1 patent

MAZDA MOTOR

1 patent

NAKAI YOSHINOBU

1 patent

MITSUBISHI CHEM CORP

1 patent

LEO KAKEN CO LTD

1 patent

SONY ELECTRONICS INC

1 patent

SATOH YOSHINORI

1 patent

TEIJIN LTD

1 patent

SATURN LICENSING LLC

1 patent

HIRABAYASHI KOICHIRO

1 patent

MINOPHAGEN PHARMA CO

1 patent

Showing the top 50 of 55 patents by PatentIndex Score.