Inventor
PIDWERBECKI DAVID
US40 patents
⚠️ This page may combine multiple inventors who share the name “PIDWERBECKI DAVID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
24 patentsUS9483126B2Nov 1, 2016
Smart variable torque display
INTEL CORP6 citations84
US9353560B2May 31, 2016
Smart variable torque display
INTEL CORP7 citations84
US11231757B2Jan 25, 2022
Thermal dissipation in dual-chassis devices
INTEL CORP6 citations83
US9313875B2Apr 12, 2016
Conformal coating including embedded thermal energy absorbing material
INTEL CORP9 citations83
US9980412B2May 22, 2018
Flexible heat spreader
INTEL CORP16 citations81
US9715255B2Jul 25, 2017
Belt driven hinge assembly for electronic devices
INTEL CORP4 citations73
US11267475B2Mar 8, 2022
Road surface friction based predictive driving for computer assisted or autonomous driving vehicles
INTEL CORP1 citations72
US10576986B2Mar 3, 2020
Road surface friction based predictive driving for computer assisted or autonomous driving vehicles
INTEL CORP2 citations72
USD810031SFeb 13, 2018
Protective cover for an electronic connector
INTEL CORP3 citations71
US11567508B2Jan 31, 2023
Autonomous unmanned vehicles for responding to situations
INTEL CORP3 citations70
US9971382B2May 15, 2018
Super-elastic hinge for flexible display
INTEL CORP4 citations70
US9337628B2May 10, 2016
Ionic cooling assembly for electronic device
INTEL CORP4 citations68
US12337848B2Jun 24, 2025
Road surface friction based predictive driving for computer assisted or autonomous driving vehicles
INTEL CORP0 citations62
US11807243B2Nov 7, 2023
Road surface friction based predictive driving for computer assisted or autonomous driving vehicles
INTEL CORP0 citations61
US11755080B2Sep 12, 2023
Thermal dissipation in dual-chassis devices
INTEL CORP1 citations60
US9425543B2Aug 23, 2016
Protective cover for a connector
INTEL CORP2 citations60
US11545410B2Jan 3, 2023
Enhanced systems and methods for improved heat transfer from semiconductor packages
INTEL CORP0 citations50
US10804168B2Oct 13, 2020
Induced warpage of a thermal conductor
INTEL CORP0 citations50
US10418291B2Sep 17, 2019
Induced warpage of a thermal conductor
INTEL CORP0 citations50
US10027160B2Jul 17, 2018
Integration of wireless charging coil to a chassis
INTEL CORP0 citations48
US9451716B1Sep 20, 2016
Serviceable chassis for devices
INTEL CORP0 citations48
US9847624B2Dec 19, 2017
Ionic cooling assembly for electronic device
INTEL CORP1 citations47
US10152100B2Dec 11, 2018
Retractable heat exchanger
INTEL CORP0 citations39
US9765439B2Sep 19, 2017
Electroplated plastic chassis for electronic device
INTEL CORP0 citations36
HEWLETT PACKARD CO
7 patentsUS6146915ANov 14, 2000
Reduced size printhead for an inkjet printer
HEWLETT PACKARD CO56 citations95
US6402296B1Jun 11, 2002
High resolution inkjet printer
HEWLETT PACKARD CO21 citations92
US6293654B1Sep 25, 2001
Printhead apparatus
HEWLETT PACKARD CO34 citations92
US6145963ANov 14, 2000
Reduced size printhead for an inkjet printer
HEWLETT PACKARD CO37 citations91
US6489084B1Dec 3, 2002
Fine detail photoresist barrier
HEWLETT PACKARD CO25 citations90
US6161923ADec 19, 2000
Fine detail photoresist barrier
HEWLETT PACKARD CO32 citations90
US6007188ADec 28, 1999
Particle tolerant printhead
HEWLETT PACKARD CO41 citations89
PIDWERBECKI DAVID
3 patentsUS9226428B2Dec 29, 2015
High heat capacity electronic components and methods for fabricating
PIDWERBECKI DAVID10 citations82
US8141990B2Mar 27, 2012
Ink ejection device
PIDWERBECKI DAVID5 citations61
US10305529B2May 28, 2019
Using materials to increase structural rigidity, decrease size, improve safety, enhance thermal performance and speed charging in small form factor devices
PIDWERBECKI DAVID1 citations56