Inventor · disambiguated record
Byoung-Ju Kang
Also filed as: KANG BYOUNG JU
3 granted patents·1 pending application·48 citations·filing 2000–2007
70Inventor score
Top patents by PatentIndex Score
4 records- 0175US6372649B1Method for forming multi-level metal interconnectionHYUNDAI ELECTRONICS IND·Filed 2000·Granted Apr 16, 2002·31 cites·13 claims
- 0265US6287938B2Method for manufacturing shallow trench isolation in semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 2000·Granted Sep 11, 2001·15 cites·9 claims
- 0340US6329236B1Method for fabricating resistive load static random access memory deviceHYUNDAI ELECTRONICS IND·Filed 2000·Granted Dec 11, 2001·2 cites·7 claims
- 0439US2008160741A1Method of manufacturing semiconductor deviceDONGBU HITEK CO LTD·Filed 2007·Application pending·0 cites
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