P

Inventor

FRICKER JEAN-PHILIPPE

US45 patents
⚠️ This page may combine multiple inventors who share the name “FRICKER JEAN-PHILIPPE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CEREBRAS SYSTEMS INC

23 patents
US10468369B2Nov 5, 2019

Apparatus and method for securing substrates with varying coefficients of thermal expansion

CEREBRAS SYSTEMS INC18 citations94
US11367701B2Jun 21, 2022

Apparatus and method for securing substrates with varying coefficients of thermal expansion

CEREBRAS SYSTEMS INC4 citations84
US10892244B2Jan 12, 2021

Apparatus and method for securing substrates with varying coefficients of thermal expansion

CEREBRAS SYSTEMS INC6 citations84
US10672732B2Jun 2, 2020

Apparatus and method for securing substrates with varying coefficients of thermal expansion

CEREBRAS SYSTEMS INC8 citations84
US10366967B2Jul 30, 2019

Apparatus and method for multi-die interconnection

CEREBRAS SYSTEMS INC4 citations83
US10332860B2Jun 25, 2019

Apparatus and method for multi-die interconnection

CEREBRAS SYSTEMS INC5 citations83
US10242891B2Mar 26, 2019

Apparatus and method for securing components of an integrated circuit

CEREBRAS SYSTEMS INC9 citations83
US10777532B2Sep 15, 2020

Apparatus and method for multi-die interconnection

CEREBRAS SYSTEMS INC1 citations72
US10453717B2Oct 22, 2019

Apparatus and method for securing components of an integrated circuit

CEREBRAS SYSTEMS INC3 citations72
US10361172B2Jul 23, 2019

Apparatus and method for multi-die interconnection

CEREBRAS SYSTEMS INC2 citations72
US12463139B2Nov 4, 2025

Apparatus and method for fabricating multi-die interconnection using lithography process

CEREBRAS SYSTEMS INC0 citations62
US11626342B2Apr 11, 2023

Apparatuses and methods for implementing a sliding thermal interface between substrates with varying coefficients of thermal expansion

CEREBRAS SYSTEMS INC0 citations62
US11367686B2Jun 21, 2022

Apparatus and method for multi-die interconnection

CEREBRAS SYSTEMS INC0 citations62
US11201137B2Dec 14, 2021

Systems and methods for powering an integrated circuit having multiple interconnected die

CEREBRAS SYSTEMS INC0 citations62
US10971401B2Apr 6, 2021

Systems and methods for precision fabrication of an orifice within an integrated circuit

CEREBRAS SYSTEMS INC0 citations62
US10957595B2Mar 23, 2021

Systems and methods for precision fabrication of an orifice within an integrated circuit

CEREBRAS SYSTEMS INC0 citations62
US10923456B2Feb 16, 2021

Systems and methods for hierarchical exposure of an integrated circuit having multiple interconnected die

CEREBRAS SYSTEMS INC1 citations62
US10923412B2Feb 16, 2021

Apparatuses and methods for implementing a sliding thermal interface between substrates with varying coefficients of thermal expansion

CEREBRAS SYSTEMS INC1 citations62
US11631600B2Apr 18, 2023

Apparatus and method for securing components of an integrated circuit

CEREBRAS SYSTEMS INC0 citations61
US11145530B2Oct 12, 2021

System and method for alignment of an integrated circuit

CEREBRAS SYSTEMS INC1 citations58
US10840216B2Nov 17, 2020

Systems and methods for powering an integrated circuit having multiple interconnected die

CEREBRAS SYSTEMS INC0 citations52
US10784128B2Sep 22, 2020

Apparatus and method for securing components of an integrated circuit

CEREBRAS SYSTEMS INC0 citations51
US10586784B2Mar 10, 2020

Apparatus and method for multi-die interconnection

CEREBRAS SYSTEMS INC0 citations51

EMC CORP

7 patents

ADVANCED MICRO DEVICES INC

6 patents

FRICKER JEAN-PHILIPPE

5 patents

EMC IP HOLDING CO LLC

2 patents

LOGITECH EUROP SA

1 patent

ALCATEL LUCENT USA INC

1 patent