Inventor
LANGE NICO
DE4 patents
⚠️ This page may combine multiple inventors who share the name “LANGE NICO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PAC TECH—PACKAGING TECH GMBH
2 patentsUS12349287B2Jul 1, 2025
Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole
PAC TECH—PACKAGING TECH GMBH0 citations56
US12028987B2Jul 2, 2024
Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole
PAC TECH—PACKAGING TECH GMBH1 citations56