P

Inventor

OLAC-VAW ROMAN W

US18 patents

Patents

18 patents
US11335601B2May 17, 2022

Non-planar I/O and logic semiconductor devices having different workfunction on common substrate

INTEL CORP6 citations85
US10892192B2Jan 12, 2021

Non-planar I/O and logic semiconductor devices having different workfunction on common substrate

INTEL CORP5 citations83
US10692771B2Jun 23, 2020

Non-planar I/O and logic semiconductor devices having different workfunction on common substrate

INTEL CORP4 citations83
US10229853B2Mar 12, 2019

Non-planar I/O and logic semiconductor devices having different workfunction on common substrate

INTEL CORP4 citations83
US10950606B2Mar 16, 2021

Dual fin endcap for self-aligned gate edge (SAGE) architectures

INTEL CORP2 citations73
US11823954B2Nov 21, 2023

Non-planar I/O and logic semiconductor devices having different workfunction on common substrate

INTEL CORP2 citations72
US10756210B2Aug 25, 2020

Depletion mode gate in ultrathin FINFET based architecture

INTEL CORP3 citations72
US9947585B2Apr 17, 2018

Multi-gate transistor with variably sized fin

INTEL CORP5 citations72
US12191207B2Jan 7, 2025

Non-planar I/O and logic semiconductor devices having different workfunction on common substrate

INTEL CORP0 citations62
US11075286B2Jul 27, 2021

Hybrid finfet structure with bulk source/drain regions

INTEL CORP0 citations62
US10964690B2Mar 30, 2021

Resistor between gates in self-aligned gate edge architecture

INTEL CORP1 citations62
US10930729B2Feb 23, 2021

Fin-based thin film resistor

INTEL CORP0 citations62
US10892261B2Jan 12, 2021

Metal resistor and self-aligned gate edge (SAGE) architecture having a metal resistor

INTEL CORP1 citations62
US11967615B2Apr 23, 2024

Dual threshold voltage (VT) channel devices and their methods of fabrication

INTEL CORP0 citations51
US10854757B2Dec 1, 2020

FINFET based junctionless wrap around structure

INTEL CORP0 citations51
US10164115B2Dec 25, 2018

Non-linear fin-based devices

INTEL CORP0 citations51
US10761264B2Sep 1, 2020

Transmission lines using bending fins from local stress

INTEL CORP0 citations50
US10784378B2Sep 22, 2020

Ultra-scaled fin pitch having dual gate dielectrics

INTEL CORP0 citations40