P

Inventor

CHANG HSU-YU

US33 patents
⚠️ This page may combine multiple inventors who share the name “CHANG HSU-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

31 patents
US11094782B1Aug 17, 2021

Gate-all-around integrated circuit structures having depopulated channel structures

INTEL CORP8 citations83
US12369358B2Jul 22, 2025

Co-integrated high performance nanoribbon transistors with high voltage thick gate finFET devices

INTEL CORP2 citations73
US11437483B2Sep 6, 2022

Gate-all-around integrated circuit structures having dual nanoribbon channel structures

INTEL CORP2 citations72
US10756210B2Aug 25, 2020

Depletion mode gate in ultrathin FINFET based architecture

INTEL CORP3 citations72
US9947585B2Apr 17, 2018

Multi-gate transistor with variably sized fin

INTEL CORP5 citations72
US10192969B2Jan 29, 2019

Transistor gate metal with laterally graduated work function

INTEL CORP4 citations71
US12249622B2Mar 11, 2025

Nanoribbon thick gate devices with differential ribbon spacing and width for SOC applications

INTEL CORP1 citations63
US12317585B2May 27, 2025

Adjacent gate-all-around integrated circuit structures having non-merged epitaxial source or drain regions

INTEL CORP0 citations62
US11075286B2Jul 27, 2021

Hybrid finfet structure with bulk source/drain regions

INTEL CORP0 citations62
US10964690B2Mar 30, 2021

Resistor between gates in self-aligned gate edge architecture

INTEL CORP1 citations62
US10930729B2Feb 23, 2021

Fin-based thin film resistor

INTEL CORP0 citations62
US10559688B2Feb 11, 2020

Transistor with thermal performance boost

INTEL CORP1 citations62
US12453145B2Oct 21, 2025

Single gated 3D nanowire inverter for high density thick gate SoC applications

INTEL CORP0 citations61
US12349411B2Jul 1, 2025

Gate-all-around integrated circuit structures having dual nanoribbon channel structures

INTEL CORP0 citations61
US11862703B2Jan 2, 2024

Gate-all-around integrated circuit structures having dual nanoribbon channel structures

INTEL CORP0 citations61
US11791380B2Oct 17, 2023

Single gated 3D nanowire inverter for high density thick gate SOC applications

INTEL CORP0 citations61
US11581404B2Feb 14, 2023

Gate-all-around integrated circuit structures having depopulated channel structures

INTEL CORP0 citations61
US10811751B2Oct 20, 2020

Monolithic splitter using re-entrant poly silicon waveguides

INTEL CORP1 citations60
US11563000B2Jan 24, 2023

Gate endcap architectures having relatively short vertical stack

INTEL CORP0 citations52
US12568682B2Mar 3, 2026

Nanoribbon thick gate device with hybrid dielectric tuning for high breakdown and VT modulation

INTEL CORP0 citations51
US12040395B2Jul 16, 2024

High voltage extended-drain MOS (EDMOS) nanowire transistors

INTEL CORP0 citations51
US11967615B2Apr 23, 2024

Dual threshold voltage (VT) channel devices and their methods of fabrication

INTEL CORP0 citations51
US10854607B2Dec 1, 2020

Isolation well doping with solid-state diffusion sources for finFET architectures

INTEL CORP0 citations51
US10854757B2Dec 1, 2020

FINFET based junctionless wrap around structure

INTEL CORP0 citations51
US10643999B2May 5, 2020

Doping with solid-state diffusion sources for finFET architectures

INTEL CORP0 citations51
US10340273B2Jul 2, 2019

Doping with solid-state diffusion sources for finFET architectures

INTEL CORP0 citations51
US10164115B2Dec 25, 2018

Non-linear fin-based devices

INTEL CORP0 citations51
US11996403B2May 28, 2024

ESD diode solution for nanoribbon architectures

INTEL CORP0 citations50
US11121040B2Sep 14, 2021

Multi voltage threshold transistors through process and design-induced multiple work functions

INTEL CORP0 citations50
US10761264B2Sep 1, 2020

Transmission lines using bending fins from local stress

INTEL CORP0 citations50
US10763209B2Sep 1, 2020

MOS antifuse with void-accelerated breakdown

INTEL CORP0 citations50

UNIV NAT TAIWAN

1 patent

HAFEZ WALID M

1 patent