Inventor
CHANG HSU-YU
US33 patents
⚠️ This page may combine multiple inventors who share the name “CHANG HSU-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
31 patentsUS11094782B1Aug 17, 2021
Gate-all-around integrated circuit structures having depopulated channel structures
INTEL CORP8 citations83
US12369358B2Jul 22, 2025
Co-integrated high performance nanoribbon transistors with high voltage thick gate finFET devices
INTEL CORP2 citations73
US11437483B2Sep 6, 2022
Gate-all-around integrated circuit structures having dual nanoribbon channel structures
INTEL CORP2 citations72
US10756210B2Aug 25, 2020
Depletion mode gate in ultrathin FINFET based architecture
INTEL CORP3 citations72
US9947585B2Apr 17, 2018
Multi-gate transistor with variably sized fin
INTEL CORP5 citations72
US10192969B2Jan 29, 2019
Transistor gate metal with laterally graduated work function
INTEL CORP4 citations71
US12249622B2Mar 11, 2025
Nanoribbon thick gate devices with differential ribbon spacing and width for SOC applications
INTEL CORP1 citations63
US12317585B2May 27, 2025
Adjacent gate-all-around integrated circuit structures having non-merged epitaxial source or drain regions
INTEL CORP0 citations62
US11075286B2Jul 27, 2021
Hybrid finfet structure with bulk source/drain regions
INTEL CORP0 citations62
US10964690B2Mar 30, 2021
Resistor between gates in self-aligned gate edge architecture
INTEL CORP1 citations62
US10930729B2Feb 23, 2021
Fin-based thin film resistor
INTEL CORP0 citations62
US10559688B2Feb 11, 2020
Transistor with thermal performance boost
INTEL CORP1 citations62
US12453145B2Oct 21, 2025
Single gated 3D nanowire inverter for high density thick gate SoC applications
INTEL CORP0 citations61
US12349411B2Jul 1, 2025
Gate-all-around integrated circuit structures having dual nanoribbon channel structures
INTEL CORP0 citations61
US11862703B2Jan 2, 2024
Gate-all-around integrated circuit structures having dual nanoribbon channel structures
INTEL CORP0 citations61
US11791380B2Oct 17, 2023
Single gated 3D nanowire inverter for high density thick gate SOC applications
INTEL CORP0 citations61
US11581404B2Feb 14, 2023
Gate-all-around integrated circuit structures having depopulated channel structures
INTEL CORP0 citations61
US10811751B2Oct 20, 2020
Monolithic splitter using re-entrant poly silicon waveguides
INTEL CORP1 citations60
US11563000B2Jan 24, 2023
Gate endcap architectures having relatively short vertical stack
INTEL CORP0 citations52
US12568682B2Mar 3, 2026
Nanoribbon thick gate device with hybrid dielectric tuning for high breakdown and VT modulation
INTEL CORP0 citations51
US12040395B2Jul 16, 2024
High voltage extended-drain MOS (EDMOS) nanowire transistors
INTEL CORP0 citations51
US11967615B2Apr 23, 2024
Dual threshold voltage (VT) channel devices and their methods of fabrication
INTEL CORP0 citations51
US10854607B2Dec 1, 2020
Isolation well doping with solid-state diffusion sources for finFET architectures
INTEL CORP0 citations51
US10854757B2Dec 1, 2020
FINFET based junctionless wrap around structure
INTEL CORP0 citations51
US10643999B2May 5, 2020
Doping with solid-state diffusion sources for finFET architectures
INTEL CORP0 citations51
US10340273B2Jul 2, 2019
Doping with solid-state diffusion sources for finFET architectures
INTEL CORP0 citations51
US10164115B2Dec 25, 2018
Non-linear fin-based devices
INTEL CORP0 citations51
US11996403B2May 28, 2024
ESD diode solution for nanoribbon architectures
INTEL CORP0 citations50
US11121040B2Sep 14, 2021
Multi voltage threshold transistors through process and design-induced multiple work functions
INTEL CORP0 citations50
US10761264B2Sep 1, 2020
Transmission lines using bending fins from local stress
INTEL CORP0 citations50
US10763209B2Sep 1, 2020
MOS antifuse with void-accelerated breakdown
INTEL CORP0 citations50