Inventor

WANG BILY

TW104 patents

⚠️ This page may combine multiple inventors who share the name “WANG BILY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG BILY

HARVATEK CORP

Single-side mounted light emitting diode module

LED light source with reflecting side wall

Light emitting diode

Random partitionable dot matrix LED display

Laminated light-emitting diode display device and manufacturing method thereof

White light source

Surface mount light emitting diode package

Water-cooling heat dissipation device adopted for modulized LEDs

LED packaging structure

White light source from light emitting diode

Multiple LED chip package

Light-emitting diode

LED lamp structure and system with high-efficiency heat-dissipating function

LED chip package structure using a ceramic material as a substrate and a method for manufacturing the same

LED chip package structure with a plurality of thick guiding pins and a method for manufacturing the same

Laser diode package with heat sinking substrate

Backlight module

Mass production technique for surface mount optical device with a focusing cup

LED base

Light emitting diode

Modular illumination device with adjustable lighting angles

Laser diode antenna for mobile phone

Flat package for semiconductor diodes

Folded heat sink for semiconductor device package

Resettable fuse integrated circuit package

LED chip package structure with high-efficiency light-emitting effect and method of packing the same

Metal base design for surface mount device LED

White light source

Light-emitting diode

LED package structure and method for making the same

Metal base design for surface mount device LED (light emitting diode)

Focusing cup on a folded frame for surface mount optoelectric semiconductor package

Lighting module

High efficiency white light emitting diode and method for manufacturing the same

Circuit board for large screen LED matrix array display

Circuit for driving LED display

Light emitting diode package

IC package with stacked sheet metal substrate

Running indicator for integrated circuit package

WANG BILY

Lamp head assembly and lighting lamp tube

Package for a light emitting diode and method for fabricating the same

Reflection-type light-emitting module with high heat-dissipating and high light-generating efficiency

Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach

Simple detachable illumination structure and lamp tube

LED package base

LED package base

LED package chip classification system

YOUNGTEK ELECTRONICS CORP

Testing system and testing method for inspecting electonic devices

Surface mount package for long lead devices

(unassigned)

Cavity grid array integrated circuit package