Inventor
MANDREKAR ROHAN U
US21 patents
⚠️ This page may combine multiple inventors who share the name “MANDREKAR ROHAN U”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
11 patentsUS9646925B2May 9, 2017
Interconnect array pattern with a 3:1 signal-to-ground ratio
IBM2 citations72
US9600619B2Mar 21, 2017
Distribution of power vias in a multi-layer circuit board
IBM2 citations72
US9543241B2Jan 10, 2017
Interconnect array pattern with a 3:1 signal-to-ground ratio
IBM3 citations72
US11076493B2Jul 27, 2021
Implementing high-speed signaling via dedicated printed circuit-board media
IBM0 citations62
US10034393B2Jul 24, 2018
Implementing high-speed signaling via dedicated printed circuit-board media
IBM1 citations62
US9972566B2May 15, 2018
Interconnect array pattern with a 3:1 signal-to-ground ratio
IBM1 citations62
US9232645B2Jan 5, 2016
High speed differential wiring in glass ceramic MCMS
IBM2 citations62
US9232646B2Jan 5, 2016
High speed differential wiring in glass ceramic MCMS
IBM0 citations52
US9594865B2Mar 14, 2017
Distribution of power vias in a multi-layer circuit board
IBM0 citations51
US9456506B2Sep 27, 2016
Packaging for eight-socket one-hop SMP topology
IBM0 citations51
US9445507B2Sep 13, 2016
Packaging for eight-socket one-hop SMP topology
IBM0 citations51
CASES MOISES
3 patentsUS8242384B2Aug 14, 2012
Through hole-vias in multi-layer printed circuit boards
CASES MOISES13 citations91
US8766107B2Jul 1, 2014
Through-hole-vias in multi-layer printed circuit boards
CASES MOISES1 citations61
US8658911B2Feb 25, 2014
Through-hole-vias in multi-layer printed circuit boards
CASES MOISES3 citations61