Inventor

PENG CHIH-TANG

TW69 patents

⚠️ This page may combine multiple inventors who share the name “PENG CHIH-TANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PENG CHIH-TANG

TAIWAN SEMICONDUCTOR MFG CO LTD

Tunnel field-effect transistor

Process of manufacturing Fin-FET device

Post UV cure for gapfill improvement

Method for forming semiconductor structure with high aspect ratio

Method for forming semiconductor structure with high aspect ratio

Semiconductor strips with undercuts and methods for forming the same

Vertical-gate-all-around devices and method of fabrication thereof

Self-aligned insulated film for high-k metal gate device

Formation and in-situ treatment processes for gap fill layers

FinFET device with oxidation-resist STI liner structure

Semiconductor strips with undercuts and methods for forming the same

Method for forming semiconductor structure with high aspect ratio

FinFET device and method of forming same

Semiconductor device and method of manufacture

Integrated circuit isolation feature and method of forming the same

Semiconductor device and method of manufacture

FinFET device and method of forming same

Semiconductor device and method of manufacture

Integrated circuit isolation feature and method of forming the same

Method of forming isolation layer

FinFET structure and device

Self-aligned insulated film for high-K metal gate device

Formation and in-situ treatment processes for gap fill layers

Semiconductor device and method for atomic layer deposition of a dielectric over a substrate

Cyclic spin-on coating process for forming dielectric material

Cyclic spin-on coating process for forming dielectric material

Cyclic spin-on coating process for forming dielectric material

Post UV cure for gapfill improvement

Gap-fill method having improved gap-fill capability

Method of forming isolation layer

Semiconductor device and method for atomic layer deposition of a dielectric over a substrate

FinFET cut-last process using oxide trench fill

TAIWAN SEMICONDUCTOR MFG

Fin deformation modulation

Bond pad structure for wire bonding

Semiconductor device and method of forming vertical structure

Fin deformation modulation

Spacer shape engineering for void-free gap-filling process

Method of fabricating FinFETs

Isolation region gap fill method

Semiconductor device and method of manufacture

Fin profile structure and method of making same

Lin yu chao

Fin field effect transistors

CHANG CHIA-WEI

Fin profile structure and method of making same

NG JIN-AUN

Self-aligned insulated film for high-k metal gate device

YU WEIBO

Method of semiconductor integrated circuit fabrication

PENG CHIH-TANG

Semiconductor device and method of manufacture

LU CHANG-SHEN

Dummy FinFET structure and method of making same

LIOU YU-LING

Uniform shallow trench isolation regions and the method of forming the same

INTEGRATED CRYSTAL TECHNOLOGY

Silicon pressure micro-sensing device and the fabrication process

LEE TZE-LIANG

Method for fabricating an isolation structure