Inventor
LIN HUI-WEN
TW22 patents
⚠️ This page may combine multiple inventors who share the name “LIN HUI-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
8 patentsUS10388531B2Aug 20, 2019
Self-aligned insulated film for high-k metal gate device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US11894443B2Feb 6, 2024
Method of making gate structure of a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11380775B2Jul 5, 2022
Gate structure of a semiconductor device and method of making
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11094545B2Aug 17, 2021
Self-aligned insulated film for high-K metal gate device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10553699B2Feb 4, 2020
Gate structure of a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9978853B2May 22, 2018
Method of forming gate structure of a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9577051B2Feb 21, 2017
Spacer structures of a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9779947B2Oct 3, 2017
Self-aligned insulated film for high-k metal gate device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
TAIWAN SEMICONDUCTOR MFG
5 patentsUS8557659B2Oct 15, 2013
Spacer structures of a semiconductor device
TAIWAN SEMICONDUCTOR MFG23 citations92
US9219124B2Dec 22, 2015
Metal gate semiconductor device
TAIWAN SEMICONDUCTOR MFG7 citations84
USRE45060EAug 5, 2014
Spacer structures of a semiconductor device
TAIWAN SEMICONDUCTOR MFG4 citations84
US8772147B2Jul 8, 2014
Spacer structures of a semiconductor device
TAIWAN SEMICONDUCTOR MFG3 citations63
US9252224B2Feb 2, 2016
Self-aligned insulated film for high-k metal gate device
TAIWAN SEMICONDUCTOR MFG0 citations51
XILINX INC
4 patentsUS11119146B1Sep 14, 2021
Testing of bonded wafers and structures for testing bonded wafers
XILINX INC13 citations85
US11164749B1Nov 2, 2021
Warpage reduction
XILINX INC7 citations83
US10720377B2Jul 21, 2020
Electronic device apparatus with multiple thermally conductive paths for heat dissipation
XILINX INC6 citations82
US11114344B1Sep 7, 2021
IC die with dummy structures
XILINX INC1 citations62