Inventor
CHEN LINLIN
CN39 patents
⚠️ This page may combine multiple inventors who share the name “CHEN LINLIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMITOOL INC
29 patentsUS6932892B2Aug 23, 2005
Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
SEMITOOL INC226 citations99
US6638410B2Oct 28, 2003
Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
SEMITOOL INC110 citations99
US6565729B2May 20, 2003
Method for electrochemically depositing metal on a semiconductor workpiece
SEMITOOL INC435 citations99
US6309524B1Oct 30, 2001
Methods and apparatus for processing the surface of a microelectronic workpiece
SEMITOOL INC107 citations99
US6290833B1Sep 18, 2001
Method for electrolytically depositing copper on a semiconductor workpiece
SEMITOOL INC121 citations99
US6277263B1Aug 21, 2001
Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
SEMITOOL INC151 citations99
US6197181B1Mar 6, 2001
Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece
SEMITOOL INC649 citations99
US6309520B1Oct 30, 2001
Methods and apparatus for processing the surface of a microelectronic workpiece
SEMITOOL INC92 citations98
US6508920B1Jan 21, 2003
Apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device
SEMITOOL INC88 citations97
US6632345B1Oct 14, 2003
Apparatus and method for electrolytically depositing a metal on a workpiece
SEMITOOL INC47 citations96
US6303010B1Oct 16, 2001
Methods and apparatus for processing the surface of a microelectronic workpiece
SEMITOOL INC81 citations96
US7332066B2Feb 19, 2008
Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
SEMITOOL INC19 citations93
US6811675B2Nov 2, 2004
Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
SEMITOOL INC31 citations93
US6911127B2Jun 28, 2005
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
SEMITOOL INC17 citations92
US6869510B2Mar 22, 2005
Methods and apparatus for processing the surface of a microelectronic workpiece
SEMITOOL INC26 citations92
US6806186B2Oct 19, 2004
Submicron metallization using electrochemical deposition
SEMITOOL INC21 citations92
US6699373B2Mar 2, 2004
Apparatus for processing the surface of a microelectronic workpiece
SEMITOOL INC40 citations92
US6645356B1Nov 11, 2003
Methods and apparatus for processing the surface of a microelectronic workpiece
SEMITOOL INC28 citations92
US6527925B1Mar 4, 2003
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
SEMITOOL INC23 citations92
US7135404B2Nov 14, 2006
Method for applying metal features onto barrier layers using electrochemical deposition
SEMITOOL INC24 citations91
US7115196B2Oct 3, 2006
Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
SEMITOOL INC11 citations84
US6919013B2Jul 19, 2005
Apparatus and method for electrolytically depositing copper on a workpiece
SEMITOOL INC7 citations74
US7462269B2Dec 9, 2008
Method for low temperature annealing of metallization micro-structures in the production of a microelectronic device
SEMITOOL INC5 citations73
US7144805B2Dec 5, 2006
Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density
SEMITOOL INC8 citations73
US7048841B2May 23, 2006
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
SEMITOOL INC5 citations73
US7001471B2Feb 21, 2006
Method and apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device
SEMITOOL INC5 citations73
US6939448B2Sep 6, 2005
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
SEMITOOL INC6 citations73
US6899805B2May 31, 2005
Automated chemical management system executing improved electrolyte analysis method
SEMITOOL INC4 citations63
US6994776B2Feb 7, 2006
Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device
SEMITOOL INC5 citations62
TEXAS INSTRUMENTS INC
6 patentsUS6743719B1Jun 1, 2004
Method for forming a conductive copper structure
TEXAS INSTRUMENTS INC23 citations92
US6730597B1May 4, 2004
Pre-ECD wet surface modification to improve wettability and reduced void defect
TEXAS INSTRUMENTS INC13 citations82
US6998275B2Feb 14, 2006
Hydrogen-less CVD TiN process for FeRAM VIA0 barrier application
TEXAS INSTRUMENTS INC15 citations81
US6908851B2Jun 21, 2005
Corrosion resistance for copper interconnects
TEXAS INSTRUMENTS INC8 citations74
US7198705B2Apr 3, 2007
Plating-rinse-plating process for fabricating copper interconnects
TEXAS INSTRUMENTS INC2 citations63
US7067015B2Jun 27, 2006
Modified clean chemistry and megasonic nozzle for removing backside CMP slurries
TEXAS INSTRUMENTS INC4 citations62