Inventor
HARADA TATSUYA
JP32 patents
⚠️ This page may combine multiple inventors who share the name “HARADA TATSUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TDK CORP
10 patentsUS6374479B1Apr 23, 2002
Method and apparatus for manufacturing slider
TDK CORP45 citations94
US7557439B1Jul 7, 2009
Layered chip package that implements memory device
TDK CORP31 citations92
US7443633B2Oct 28, 2008
Thin-film magnetic head for perpendicular magnetic recording and manufacturing method of thin-film magnetic head
TDK CORP45 citations92
US7885036B2Feb 8, 2011
Magnetic device, perpendicular magnetic recording head, magnetic recording system, method of forming magnetic layer pattern, and method of manufacturing perpendicular magnetic recording head
TDK CORP9 citations84
US7293345B2Nov 13, 2007
Method of manufacturing a thin film magnetic recording head
TDK CORP8 citations74
US6757964B2Jul 6, 2004
Apparatus for manufacturing sliders
TDK CORP11 citations72
US7826175B2Nov 2, 2010
Thin-film magnetic head including two magnetic layers and flat spiral coil, and method of manufacturing same
TDK CORP3 citations62
US7874063B2Jan 25, 2011
Thin film magnetic head integrated structure
TDK CORP4 citations61
US7995308B2Aug 9, 2011
Magnetic head for perpendicular magnetic recording and method of manufacturing same, the magnetic head incuding pole layer and two shields sandwiching the pole layer
TDK CORP1 citations51
US9930779B2Mar 27, 2018
Through wiring substrate
TDK CORP0 citations42
HEADWAY TECHNOLOGIES INC
7 patentsUS7863095B2Jan 4, 2011
Method of manufacturing layered chip package
HEADWAY TECHNOLOGIES INC233 citations99
US7968374B2Jun 28, 2011
Layered chip package with wiring on the side surfaces
HEADWAY TECHNOLOGIES INC17 citations92
US7767494B2Aug 3, 2010
Method of manufacturing layered chip package
HEADWAY TECHNOLOGIES INC24 citations92
US7745259B2Jun 29, 2010
Layered chip package and method of manufacturing same
HEADWAY TECHNOLOGIES INC24 citations92
US7964976B2Jun 21, 2011
Layered chip package and method of manufacturing same
HEADWAY TECHNOLOGIES INC8 citations84
US7868442B2Jan 11, 2011
Layered chip package and method of manufacturing same
HEADWAY TECHNOLOGIES INC10 citations84
US7846772B2Dec 7, 2010
Layered chip package and method of manufacturing same
HEADWAY TECHNOLOGIES INC6 citations74
SASAKI YOSHITAKA
5 patentsUS8154116B2Apr 10, 2012
Layered chip package with heat sink
SASAKI YOSHITAKA11 citations84
US8455349B2Jun 4, 2013
Layered chip package and method of manufacturing same
SASAKI YOSHITAKA3 citations63
US8134229B2Mar 13, 2012
Layered chip package
SASAKI YOSHITAKA5 citations63
US8324741B2Dec 4, 2012
Layered chip package with wiring on the side surfaces
SASAKI YOSHITAKA3 citations62
US8513034B2Aug 20, 2013
Method of manufacturing layered chip package
SASAKI YOSHITAKA0 citations52
HARADA TATSUYA
3 patentsUS8590658B2Nov 26, 2013
Occupant protection device
HARADA TATSUYA7 citations79
US8423485B2Apr 16, 2013
Correspondence learning apparatus and method and correspondence learning program, annotation apparatus and method and annotation program, and retrieval apparatus and method and retrieval program
HARADA TATSUYA1 citations48
US8325440B2Dec 4, 2012
Magnetic head including a pole layer and an antireflection film sandwiched by two shields
HARADA TATSUYA0 citations39