Inventor

Feng jun-hao

TW2 patents

Patents

2 patents

US12132003B2Oct 29, 2024

Electronic package and manufacturing method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations53

US12451416B2Oct 21, 2025

Electronic package and manufacturing method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations47