Inventor
HIRAI KEIZO
JP5 patents
Patents
5 patentsUS6783434B1Aug 31, 2004
CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate
HITACHI CHEMICAL CO LTD61 citations94
US6372859B1Apr 16, 2002
Thermoresistance adhesive and semiconductor device using the same
HITACHI CHEMICAL CO LTD29 citations91
US5840432ANov 24, 1998
Electroconductive paste
HITACHI CHEMICAL CO LTD36 citations91
US7163644B2Jan 16, 2007
CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate
HITACHI CHEMICAL CO LTD8 citations72
US6042933AMar 28, 2000
Electric circuit device having circuit conductors using an electroconductive paste
HITACHI CHEMICAL CO LTD11 citations72