Inventor
LOHIA ALOK KUMAR
US12 patents
⚠️ This page may combine multiple inventors who share the name “LOHIA ALOK KUMAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
9 patentsUS9373569B1Jun 21, 2016
Flat no-lead packages with electroplated edges
TEXAS INSTRUMENTS INC4 citations82
US9768098B2Sep 19, 2017
Packaged semiconductor device having stacked attached chips overhanging the assembly pad
TEXAS INSTRUMENTS INC6 citations71
US11769247B2Sep 26, 2023
Exposed pad integrated circuit package
TEXAS INSTRUMENTS INC0 citations60
US11195269B2Dec 7, 2021
Exposed pad integrated circuit package
TEXAS INSTRUMENTS INC0 citations60
US9576886B1Feb 21, 2017
Flat no-lead packages with electroplated edges
TEXAS INSTRUMENTS INC1 citations60
US9219019B2Dec 22, 2015
Packaged semiconductor devices having solderable lead surfaces exposed by grooves in package compound
TEXAS INSTRUMENTS INC3 citations60
US10580723B2Mar 3, 2020
Flat no-lead packages with electroplated edges
TEXAS INSTRUMENTS INC0 citations50
US10366947B2Jul 30, 2019
Flat no-lead packages with electroplated edges
TEXAS INSTRUMENTS INC0 citations50
US9721859B2Aug 1, 2017
Semi-hermetic semiconductor package
TEXAS INSTRUMENTS INC0 citations39
ABB POWER ELECTRONICS INC
3 patentsUS10993325B2Apr 27, 2021
Interposer printed circuit boards for power modules
ABB POWER ELECTRONICS INC7 citations79
US11490517B2Nov 1, 2022
Interposer printed circuit boards for power modules
ABB POWER ELECTRONICS INC1 citations57
US11439013B2Sep 6, 2022
Interposer printed circuit boards for power modules
ABB POWER ELECTRONICS INC1 citations57