Inventor
KOZASA KAZUAKI
JP13 patents
⚠️ This page may combine multiple inventors who share the name “KOZASA KAZUAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SUMCO CORP
5 patentsUS9991110B2Jun 5, 2018
Method for manufacturing semiconductor wafer
SUMCO CORP7 citations78
US9956663B2May 1, 2018
Method for polishing silicon wafer
SUMCO CORP3 citations67
US11554458B2Jan 17, 2023
Polishing head, wafer polishing apparatus using the same, and wafer polishing method using the same
SUMCO CORP0 citations50
US11628534B2Apr 18, 2023
Silicon wafer single-side polishing method
SUMCO CORP0 citations47
US11211285B2Dec 28, 2021
Method of producing bonded wafer and bonded wafer
SUMCO CORP0 citations41
KOZASA KAZUAKI
5 patentsUS9305850B2Apr 5, 2016
Etching method and etching apparatus of semiconductor wafer
KOZASA KAZUAKI3 citations70
US8303373B2Nov 6, 2012
Slurry supplying apparatus and method of polishing semiconductor wafer utilizing same
KOZASA KAZUAKI3 citations60
US8273260B2Sep 25, 2012
Etching method and etching apparatus of semiconductor wafer
KOZASA KAZUAKI2 citations60
US8992791B2Mar 31, 2015
Method of cleaning semiconductor wafer and semiconductor wafer
KOZASA KAZUAKI0 citations36
US8696809B2Apr 15, 2014
Manufacturing method of epitaxial silicon wafer and substrate cleaning apparatus
KOZASA KAZUAKI0 citations36
SUMCO TECHXIV CORP
3 patentsUS7540800B2Jun 2, 2009
Rough polishing method of semiconductor wafer and polishing apparatus of semiconductor wafer
SUMCO TECHXIV CORP10 citations81
US7303691B2Dec 4, 2007
Polishing method for semiconductor wafer
SUMCO TECHXIV CORP6 citations56
US7666063B2Feb 23, 2010
Rough polishing method of semiconductor wafer and polishing apparatus of semiconductor wafer
SUMCO TECHXIV CORP0 citations49