P

Inventor

KAJIWARA JIRO

JP20 patents
⚠️ This page may combine multiple inventors who share the name “KAJIWARA JIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MULTI PLANAR TECHNOLOGIES INC

8 patents
US6558232B1May 6, 2003

System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control

MULTI PLANAR TECHNOLOGIES INC92 citations96
US6506105B1Jan 14, 2003

System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control

MULTI PLANAR TECHNOLOGIES INC105 citations96
US6893327B2May 17, 2005

Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface

MULTI PLANAR TECHNOLOGIES INC42 citations92
US6540590B1Apr 1, 2003

Chemical mechanical polishing apparatus and method having a rotating retaining ring

MULTI PLANAR TECHNOLOGIES INC26 citations92
US6527625B1Mar 4, 2003

Chemical mechanical polishing apparatus and method having a soft backed polishing head

MULTI PLANAR TECHNOLOGIES INC21 citations92
US6966822B2Nov 22, 2005

System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control

MULTI PLANAR TECHNOLOGIES INC18 citations91
US6623343B2Sep 23, 2003

System and method for CMP head having multi-pressure annular zone subcarrier material removal control

MULTI PLANAR TECHNOLOGIES INC51 citations91
US6887132B2May 3, 2005

Slurry distributor for chemical mechanical polishing apparatus and method of using the same

MULTI PLANAR TECHNOLOGIES INC44 citations89

MITSUBISHI MATERIALS CORP

4 patents
US6398906B1Jun 4, 2002

Wafer transfer apparatus and wafer polishing apparatus, and method for manufacturing wafer

MITSUBISHI MATERIALS CORP63 citations96
US6368189B1Apr 9, 2002

Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure

MITSUBISHI MATERIALS CORP75 citations94
US6346038B1Feb 12, 2002

Wafer loading/unloading device and method for producing wafers

MITSUBISHI MATERIALS CORP23 citations87
US6508696B1Jan 21, 2003

Wafer-polishing head and polishing apparatus having the same

MITSUBISHI MATERIALS CORP15 citations84

CYBEQ SYST INC

2 patents
US5443416AAug 22, 1995

Rotary union for coupling fluids in a wafer polishing apparatus

CYBEQ SYST INC148 citations94
US5527209AJun 18, 1996

Wafer polisher head adapted for easy removal of wafers

CYBEQ SYST INC109 citations93

EBARA CORP

2 patents
US7029382B2Apr 18, 2006

Apparatus for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure

EBARA CORP17 citations89
US7311586B2Dec 25, 2007

Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure

EBARA CORP13 citations81

MULTIPLANAR TECHNOLOGIES INC

1 patent
US7118456B2Oct 10, 2006

Polishing head, retaining ring for use therewith and method fo polishing a substrate

MULTIPLANAR TECHNOLOGIES INC13 citations79

MULTI PLANAR TECHNOLOGYIES INC

1 patent
US6641461B2Nov 4, 2003

Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal

MULTI PLANAR TECHNOLOGYIES INC4 citations57

SUMCO CORP

1 patent
US11554458B2Jan 17, 2023

Polishing head, wafer polishing apparatus using the same, and wafer polishing method using the same

SUMCO CORP0 citations50

HORIOKA YUKICHI

1 patent
US9250014B2Feb 2, 2016

Vacuum storage method and device for crystalline material

HORIOKA YUKICHI0 citations36