Inventor
TERAKAWA RYOYA
JP7 patents
⚠️ This page may combine multiple inventors who share the name “TERAKAWA RYOYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SUMCO CORP
6 patentsUS10710209B2Jul 14, 2020
Wafer polishing apparatus and polishing head used for same
SUMCO CORP2 citations64
US12285840B2Apr 29, 2025
Polishing head, polishing apparatus, and method of manufacturing semiconductor wafer
SUMCO CORP0 citations50
US11554458B2Jan 17, 2023
Polishing head, wafer polishing apparatus using the same, and wafer polishing method using the same
SUMCO CORP0 citations50
US12496678B2Dec 16, 2025
Method of polishing silicon wafer and method of producing silicon wafer
SUMCO CORP0 citations49
US10744616B2Aug 18, 2020
Wafer polishing method and apparatus
SUMCO CORP0 citations48
US12179308B2Dec 31, 2024
Method of transferring semiconductor wafer to polishing apparatus and method of producing semiconductor wafer
SUMCO CORP0 citations46