Inventor

KASHIHARA TAKAKI

JP2 patents

Patents

2 patents

US7397139B2Jul 8, 2008

Epoxy resin molding material for sealing use and semiconductor device

HITACHI CHEMICAL CO LTD33 citations87

US6211277B1Apr 3, 2001

Encapsulating material and LOC structure semiconductor device using the same

HITACHI CHEMICAL CO LTD7 citations69