Inventor

NARA NAOKI

JP3 patents

Patents

3 patents

US7397139B2Jul 8, 2008

Epoxy resin molding material for sealing use and semiconductor device

HITACHI CHEMICAL CO LTD33 citations87

US6005030ADec 21, 1999

Epoxy resin composition for semiconductor sealing and resin molded type semiconductor device sealed with the epoxy resin composition

HITACHI CHEMICAL CO LTD18 citations76

US6211277B1Apr 3, 2001

Encapsulating material and LOC structure semiconductor device using the same

HITACHI CHEMICAL CO LTD7 citations69