Inventor

JOW UEI-MING

US46 patents

⚠️ This page may combine multiple inventors who share the name “JOW UEI-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JOW UEI-MING

IND TECH RES INST

Miniaturized multi-layer balun

High dielectric antenna substrate and antenna thereof

Inductor devices

Method for testing component built in circuit board

Embedded inductor devices and fabrication methods thereof

Apparatus and method for testing component built in circuit board

Mirror image shielding structure

Structure of multi-electrode capacitor and method for manufacturing process of the same

Balanced-to-unbalanced transformer embedded with filter

Embedded microelectronic capacitor equipped with geometrically-centered electrodes and method of fabrication

High dielectric antenna substrate and antenna thereof

Complementary mirror image embedded planar resistor architecture

Film resistor embedded in multi-layer circuit board and manufacturing method thereof

Multi-layered printed circuit board embedded with filter

Capacitor structure

Multi-functional composite substrate structure

Embedded microelectronic capacitor incorporating ground shielding layers and method for fabrication

Capacitive apparatus and manufacturing method for a built-in capacitor with a non-symmetrical electrode

Circuit board with embedded components and manufacturing and measuring method thereof

Test method of embedded capacitor and test system thereof

High-frequency switch in multi-layer substrate

Symmetrical capacitor

Adjustable resistor embedded in multi-layered substrate and method for forming the same

QUALCOMM INC

Package on package (PoP) integrated device comprising a capacitor in a substrate

High quality factor inductor and high quality factor filter in package substrate or printed circuit board (PCB)

Flip-chip employing integrated cavity filter, and related components, systems, and methods

Flip-chip employing integrated cavity filter, and related components, systems, and methods

Substrate comprising stacks of interconnects, interconnect on solder resist layer and interconnect on side portion of substrate

Inductor structure in a semiconductor device

Patterned grounds and methods of forming the same

Multi-layer ground shield structure of interconnected elements

Multi-layer interconnected spiral capacitor

High quality factor filter implemented in wafer level packaging (WLP) integrated device

VERILY LIFE SCIENCES LLC

Device, system and method for detecting overlap of an ophthalmic device by an eyelid

Antenna configuration for compact glucose monitor

Antenna configuration for compact glucose monitor

Smart contact lens with antenna and sensor

Device, system and method for detecting overlap of an ophthalmic device by an eyelid

Antenna with extended range

Multi-antenna wearable device

Antenna configuration for compact glucose monitor

JOW UEI-MING

High frequency and wide band impedance matching via

Multi-functional composite substrate structure

Mirror image shielding structure

IND TECHNOLOGY RERSEARCH INST

Vertical complementary fractal antenna

GOOGLE LLC

Display module excitation for wireless communications