Inventor
CHEN LIU
DE18 patents
⚠️ This page may combine multiple inventors who share the name “CHEN LIU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
11 patentsUS9681558B2Jun 13, 2017
Module with integrated power electronic circuitry and logic circuitry
INFINEON TECHNOLOGIES AG24 citations92
US9385059B2Jul 5, 2016
Overmolded substrate-chip arrangement with heat sink
INFINEON TECHNOLOGIES AG3 citations72
US9564578B2Feb 7, 2017
Semiconductor package with integrated magnetic field sensor
INFINEON TECHNOLOGIES AG3 citations71
US9564423B2Feb 7, 2017
Power package with integrated magnetic field sensor
INFINEON TECHNOLOGIES AG5 citations70
US10727151B2Jul 28, 2020
Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package
INFINEON TECHNOLOGIES AG2 citations67
US11903132B2Feb 13, 2024
Power electronic assembly having a laminate inlay and method of producing the power electronic assembly
INFINEON TECHNOLOGIES AG0 citations60
US11632860B2Apr 18, 2023
Power electronic assembly and method of producing thereof
INFINEON TECHNOLOGIES AG0 citations60
US10168391B2Jan 1, 2019
Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto
INFINEON TECHNOLOGIES AG1 citations60
US11127853B2Sep 21, 2021
Power transistor device including first and second transistor cells having different on-resistances for improved thermal stability
INFINEON TECHNOLOGIES AG0 citations55
US10290567B2May 14, 2019
Transistor package with three-terminal clip
INFINEON TECHNOLOGIES AG0 citations51
US11239127B2Feb 1, 2022
Topside-cooled semiconductor package with molded standoff
INFINEON TECHNOLOGIES AG0 citations44