Inventor
DAECHE FRANK
DE23 patents
⚠️ This page may combine multiple inventors who share the name “DAECHE FRANK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
12 patentsUS7268436B2Sep 11, 2007
Electronic device with cavity and a method for producing the same
INFINEON TECHNOLOGIES AG125 citations97
US7031170B2Apr 18, 2006
Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device
INFINEON TECHNOLOGIES AG66 citations95
US7221048B2May 22, 2007
Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier
INFINEON TECHNOLOGIES AG26 citations92
US7011986B2Mar 14, 2006
Method for manufacturing a housing for a chip with a micromechanical structure
INFINEON TECHNOLOGIES AG15 citations84
US11004823B2May 11, 2021
Chip assembly and method of manufacturing thereof
INFINEON TECHNOLOGIES AG0 citations62
US11903132B2Feb 13, 2024
Power electronic assembly having a laminate inlay and method of producing the power electronic assembly
INFINEON TECHNOLOGIES AG0 citations60
US11632860B2Apr 18, 2023
Power electronic assembly and method of producing thereof
INFINEON TECHNOLOGIES AG0 citations60
US10186481B2Jan 22, 2019
Semiconductor device including a passive component formed in a redistribution layer
INFINEON TECHNOLOGIES AG1 citations60
US9425116B2Aug 23, 2016
Integrated circuit package and a method for manufacturing an integrated circuit package
INFINEON TECHNOLOGIES AG1 citations52
US11699640B2Jul 11, 2023
Power semiconductor module for PCB embedding, power electronic assembly having a power module embedded in a PCB, and corresponding methods of production
INFINEON TECHNOLOGIES AG0 citations50
US11183445B2Nov 23, 2021
Semiconductor arrangement, laminated semiconductor arrangement and method for fabricating a semiconductor arrangement
INFINEON TECHNOLOGIES AG0 citations49
US11562967B2Jan 24, 2023
Method for fabricating a semiconductor package, semiconductor package and embedded PCB module
INFINEON TECHNOLOGIES AG0 citations47
INFINEON TECHNOLOGIES AUSTRIA AG
5 patentsUS11996771B2May 28, 2024
Power semiconductor system having an inductor module attached to a power stage module
INFINEON TECHNOLOGIES AUSTRIA AG0 citations61
US11539291B2Dec 27, 2022
Method of manufacturing a power semiconductor system
INFINEON TECHNOLOGIES AUSTRIA AG0 citations61
US10833583B2Nov 10, 2020
Methods of manufacturing inductor modules and power semiconductor systems having inductor modules
INFINEON TECHNOLOGIES AUSTRIA AG0 citations51
US10601314B2Mar 24, 2020
Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modules
INFINEON TECHNOLOGIES AUSTRIA AG0 citations51
US9437548B2Sep 6, 2016
Chip package and method for manufacturing the same
INFINEON TECHNOLOGIES AUSTRIA AG1 citations51