Inventor
MAERZ JOSEF
DE12 patents
Patents
12 patentsUS12575429B2Mar 10, 2026
Semiconductor package having a lead frame and a clip frame
INFINEON TECHNOLOGIES AG0 citations60
US11903132B2Feb 13, 2024
Power electronic assembly having a laminate inlay and method of producing the power electronic assembly
INFINEON TECHNOLOGIES AG0 citations60
US11632860B2Apr 18, 2023
Power electronic assembly and method of producing thereof
INFINEON TECHNOLOGIES AG0 citations60
US11302613B2Apr 12, 2022
Double-sided cooled molded semiconductor package
INFINEON TECHNOLOGIES AG0 citations60
US10964628B2Mar 30, 2021
Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture
INFINEON TECHNOLOGIES AG0 citations60
US10886199B1Jan 5, 2021
Molded semiconductor package with double-sided cooling
INFINEON TECHNOLOGIES AG1 citations60
US12094807B2Sep 17, 2024
Stacked transistor chip package with source coupling
INFINEON TECHNOLOGIES AG0 citations49
US7498194B2Mar 3, 2009
Semiconductor arrangement
INFINEON TECHNOLOGIES AG0 citations48
US7233059B2Jun 19, 2007
Semiconductor arrangement
INFINEON TECHNOLOGIES AG0 citations48
US11515244B2Nov 29, 2022
Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture
INFINEON TECHNOLOGIES AG0 citations47
US11393743B2Jul 19, 2022
Semiconductor assembly with conductive frame for I/O standoff and thermal dissipation
INFINEON TECHNOLOGIES AG0 citations47
US10770399B2Sep 8, 2020
Semiconductor package having a filled conductive cavity
INFINEON TECHNOLOGIES AG0 citations32