Inventor
KO CHAN HOON
KR11 patents
⚠️ This page may combine multiple inventors who share the name “KO CHAN HOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
5 patentsUS12224235B2Feb 11, 2025
Printed circuit board
SAMSUNG ELECTRO MECH0 citations60
US11735510B2Aug 22, 2023
Printed circuit board and electronic component package
SAMSUNG ELECTRO MECH0 citations60
US11729910B2Aug 15, 2023
Printed circuit board and electronic component package
SAMSUNG ELECTRO MECH1 citations60
US11722756B2Aug 8, 2023
Camera module with droplet removing device
SAMSUNG ELECTRO MECH1 citations57
US12256492B2Mar 18, 2025
Printed circuit board
SAMSUNG ELECTRO MECH0 citations55
STATS CHIPPAC LTD
3 patentsUS7923290B2Apr 12, 2011
Integrated circuit packaging system having dual sided connection and method of manufacture thereof
STATS CHIPPAC LTD35 citations92
US7968995B2Jun 28, 2011
Integrated circuit packaging system with package-on-package and method of manufacture thereof
STATS CHIPPAC LTD3 citations62
US8004073B2Aug 23, 2011
Integrated circuit packaging system with interposer and method of manufacture thereof
STATS CHIPPAC LTD4 citations61
KO CHAN HOON
3 patentsUS8535981B2Sep 17, 2013
Integrated circuit package-on-package system with underfilling structures and method of manufacture thereof
KO CHAN HOON9 citations80
US8906740B2Dec 9, 2014
Integrated circuit packaging system having dual sided connection and method of manufacture thereof
KO CHAN HOON1 citations49
US8067828B2Nov 29, 2011
System for solder ball inner stacking module connection
KO CHAN HOON1 citations49