Inventor
TSAI CHIEN-CHENG
TW18 patents
⚠️ This page may combine multiple inventors who share the name “TSAI CHIEN-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
16 patentsUS10475794B1Nov 12, 2019
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP17 citations83
US10153165B1Dec 11, 2018
Patterning method
UNITED MICROELECTRONICS CORP3 citations73
US10381306B2Aug 13, 2019
Semiconductor memory device and a manufacturing method thereof
UNITED MICROELECTRONICS CORP1 citations72
US11233057B2Jan 25, 2022
Semiconductor structure and fabrication method thereof
UNITED MICROELECTRONICS CORP2 citations71
US10529719B2Jan 7, 2020
Semiconductor structure and fabrication method thereof
UNITED MICROELECTRONICS CORP2 citations71
US10062700B2Aug 28, 2018
Semiconductor storage device and manufacturing method thereof
UNITED MICROELECTRONICS CORP2 citations71
US10151048B1Dec 11, 2018
Manufacturing method of epitaxial contact structure in semiconductor memory device
UNITED MICROELECTRONICS CORP5 citations67
US12272646B2Apr 8, 2025
Semiconductor memory device
UNITED MICROELECTRONICS CORP0 citations62
US11769727B2Sep 26, 2023
Semiconductor memory device
UNITED MICROELECTRONICS CORP0 citations62
US11139243B2Oct 5, 2021
Semiconductor memory device
UNITED MICROELECTRONICS CORP0 citations62
US10658365B2May 19, 2020
Semiconductor device and method of manufacturing the same
UNITED MICROELECTRONICS CORP1 citations61
US10263001B2Apr 16, 2019
Method of forming semiconductor memory device
UNITED MICROELECTRONICS CORP1 citations60
US11882683B2Jan 23, 2024
Method of forming semiconductor memory device having saddle portion
UNITED MICROELECTRONICS CORP0 citations55
US10861855B2Dec 8, 2020
Semiconductor device and method of manufacturing the same
UNITED MICROELECTRONICS CORP0 citations51
US10204914B2Feb 12, 2019
Method for fabricating semiconductor device
UNITED MICROELECTRONICS CORP0 citations51
US10199258B2Feb 5, 2019
Method of fabricating isolation structure
UNITED MICROELECTRONICS CORP0 citations39