Inventor
CHANG YA-HAN
TW20 patents
⚠️ This page may combine multiple inventors who share the name “CHANG YA-HAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KINGPAK TECH INC
8 patentsUS12119363B2Oct 15, 2024
Sensor package structure
KINGPAK TECH INC2 citations72
US12108517B2Oct 1, 2024
Sensor lens assembly having non-soldering configuration
KINGPAK TECH INC2 citations72
US11257964B2Feb 22, 2022
Sensor package structure
KINGPAK TECH INC2 citations72
US11776975B2Oct 3, 2023
Sensor package structure
KINGPAK TECH INC1 citations62
US12113082B2Oct 8, 2024
Sensor package structure
KINGPAK TECH INC0 citations51
US11744010B2Aug 29, 2023
Sensor lens assembly having non-reflow configuration
KINGPAK TECH INC0 citations51
US11552120B2Jan 10, 2023
Chip-scale sensor package structure
KINGPAK TECH INC0 citations51
US10916511B1Feb 9, 2021
Method for reducing warpage occurred to substrate strip after molding process
KINGPAK TECH INC0 citations51
GIGA BYTE TECH CO LTD
5 patentsUS7559791B1Jul 14, 2009
PCB connector with identifiable characters
GIGA BYTE TECH CO LTD16 citations83
US7238045B1Jul 3, 2007
Battery-securing structure with setting-cleared elements
GIGA BYTE TECH CO LTD15 citations83
US9363919B2Jun 7, 2016
Supporting frame for computer expansion card
GIGA BYTE TECH CO LTD3 citations71
US9022805B2May 5, 2015
Cable management apparatus
GIGA BYTE TECH CO LTD3 citations62
US9444158B1Sep 13, 2016
Line concentrator having a body with an arm with a position limiting protrusion
GIGA BYTE TECH CO LTD0 citations41
TONG HSING ELECTRONIC INDUSTRIES LTD
3 patentsUS11967652B2Apr 23, 2024
Sensor package structure having solder mask frame
TONG HSING ELECTRONIC INDUSTRIES LTD1 citations71
US12224359B2Feb 11, 2025
Sensor package structure having solder mask frame
TONG HSING ELECTRONIC INDUSTRIES LTD0 citations60
US11984516B2May 14, 2024
Sensor package structure having ring-shaped solder mask frame
TONG HSING ELECTRONIC INDUSTRIES LTD0 citations60
ASUSTEK COMP INC
2 patentsUS12455609B2Oct 28, 2025
Heat dissipation control method, and electronic apparatus and portable electronic device to which heat dissipation control method is applicable
ASUSTEK COMP INC0 citations55
US12141006B2Nov 12, 2024
Electronic device and power management method therefor
ASUSTEK COMP INC0 citations45