Inventor
WEN CHING-YANG
TW18 patents
Patents
18 patentsUS12191195B2Jan 7, 2025
Method of fabricating an air gap
UNITED MICROELECTRONICS CORP2 citations73
US11476363B2Oct 18, 2022
Semiconductor device and method of fabricating the same
UNITED MICROELECTRONICS CORP2 citations73
US10923599B2Feb 16, 2021
Semiconductor device
UNITED MICROELECTRONICS CORP3 citations73
US11670567B2Jun 6, 2023
Semiconductor structure and method of wafer bonding
UNITED MICROELECTRONICS CORP2 citations70
US11881529B2Jan 23, 2024
Semiconductor device and method of fabricating the same
UNITED MICROELECTRONICS CORP0 citations62
US11296023B2Apr 5, 2022
Semiconductor device and method of fabricating the same
UNITED MICROELECTRONICS CORP0 citations62
US10763170B2Sep 1, 2020
Semiconductor device including buried insulation layer and manufacturing method thereof
UNITED MICROELECTRONICS CORP1 citations62
US12557309B2Feb 17, 2026
Semiconductor package structure
UNITED MICROELECTRONICS CORP0 citations61
US11955292B2Apr 9, 2024
Parallel-connected trench capacitor structure with multiple electrode layers and method of fabricating the same
UNITED MICROELECTRONICS CORP0 citations61
US11929213B2Mar 12, 2024
Parallel-connected trench capacitor structure with multiple electrode layers and method of fabricating the same
UNITED MICROELECTRONICS CORP0 citations61
US12080622B2Sep 3, 2024
Semiconductor structure and method of wafer bonding
UNITED MICROELECTRONICS CORP0 citations59
US11715709B2Aug 1, 2023
Manufacturing method of radiofrequency device including mold compound layer
UNITED MICROELECTRONICS CORP0 citations59
US11398548B2Jul 26, 2022
Semiconductor device
UNITED MICROELECTRONICS CORP0 citations59
US11362048B2Jun 14, 2022
Radiofrequency device and manufacturing method thereof
UNITED MICROELECTRONICS CORP0 citations59
US10903314B2Jan 26, 2021
Semiconductor device and method for manufacturing the same
UNITED MICROELECTRONICS CORP0 citations59
US11923373B2Mar 5, 2024
Semiconductor structure
UNITED MICROELECTRONICS CORP0 citations51
US12300534B2May 13, 2025
Method of forming protective layer utilized in silicon remove process
UNITED MICROELECTRONICS CORP0 citations49
US12324168B2Jun 3, 2025
Semiconductor device and manufacturing method thereof
UNITED MICROELECTRONICS CORP0 citations48