Inventor

UCHIMURA RYOICHI

JP3 patents

⚠️ This page may combine multiple inventors who share the name “UCHIMURA RYOICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI CHEMICAL CO LTD

2 patents

US11497117B2Nov 8, 2022

Metal-clad laminate, printed wiring board and semiconductor package

HITACHI CHEMICAL CO LTD0 citations47

US11040517B2Jun 22, 2021

Printed wiring board and semiconductor package

HITACHI CHEMICAL CO LTD0 citations45

SHOWA DENKO MATERIALS CO LTD

1 patent

US11938688B2Mar 26, 2024

Laminate, printed wiring board, semiconductor package, and method for manufacturing laminate

SHOWA DENKO MATERIALS CO LTD0 citations55