Inventor
Zeng Xinru
CN10 patents
Patents
10 patentsUS11133290B2Sep 28, 2021
Chip package structure with stacked chips and manufacturing method thereof
YANGTZE MEMORY TECH CO LTD8 citations82
US11688721B2Jun 27, 2023
Chip package structure and manufacturing method thereof
YANGTZE MEMORY TECH CO LTD1 citations71
US12557300B2Feb 17, 2026
Memory system packaging structure, and method for forming the same
YANGTZE MEMORY TECH CO LTD0 citations61
US12334361B2Jun 17, 2025
Substrate structure, and fabrication and packaging methods thereof
YANGTZE MEMORY TECH CO LTD0 citations61
US12205940B2Jan 21, 2025
Semiconductor package structure and packaging method thereof
YANGTZE MEMORY TECH CO LTD0 citations61
US12125827B2Oct 22, 2024
Chip package structure and manufacturing method thereof
YANGTZE MEMORY TECH CO LTD0 citations61
US11721686B2Aug 8, 2023
Semiconductor package structure and packaging method thereof
YANGTZE MEMORY TECH CO LTD0 citations61
US11694904B2Jul 4, 2023
Substrate structure, and fabrication and packaging methods thereof
YANGTZE MEMORY TECH CO LTD0 citations61
US12166012B2Dec 10, 2024
Flip-chip stacking structures and methods for forming the same
YANGTZE MEMORY TECH CO LTD0 citations51
US12593718B2Mar 31, 2026
Memory system package structure and manufacturing method thereof
YANGTZE MEMORY TECH CO LTD0 citations46