P

Inventor

FUNAKI KATSUNORI

JP15 patents
⚠️ This page may combine multiple inventors who share the name “FUNAKI KATSUNORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOKUSAI ELECTRIC CORP

13 patents
US12374527B2Jul 29, 2025

Substrate processing apparatus and method of manufacturing semiconductor device

KOKUSAI ELECTRIC CORP0 citations61
US12249485B2Mar 11, 2025

Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium

KOKUSAI ELECTRIC CORP0 citations61
US11869748B2Jan 9, 2024

Substrate processing apparatus and method of manufacturing semiconductor device

KOKUSAI ELECTRIC CORP0 citations61
US11837440B2Dec 5, 2023

Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium

KOKUSAI ELECTRIC CORP1 citations61
US12154826B2Nov 26, 2024

Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations59
US11664275B2May 30, 2023

Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP1 citations59
US12040161B2Jul 16, 2024

Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations58
US11908682B2Feb 20, 2024

Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium

KOKUSAI ELECTRIC CORP0 citations58
US11081362B2Aug 3, 2021

Method of manufacturing semiconductor device, and recording medium

KOKUSAI ELECTRIC CORP0 citations58
US11189483B2Nov 30, 2021

Method of manufacturing semiconductor device and non-transitory computer-readable recording medium

KOKUSAI ELECTRIC CORP0 citations49
US11152476B2Oct 19, 2021

Method of manufacturing semiconductor device and non-transitory computer-readable recording medium

KOKUSAI ELECTRIC CORP0 citations49
US12575347B2Mar 10, 2026

Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium

KOKUSAI ELECTRIC CORP0 citations48
US10796900B2Oct 6, 2020

Method of manufacturing semiconductor device

KOKUSAI ELECTRIC CORP0 citations39

HITACHI INT ELECTRIC INC

1 patent

TOMITA MASAYUKI

1 patent