Inventor

LIU HSIANG-WEI

TW41 patents

⚠️ This page may combine multiple inventors who share the name “LIU HSIANG-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIU HSIANG-WEI

TAIWAN SEMICONDUCTOR MFG CO LTD

Split rail structures located in adjacent metal layers

Split rail structures located in adjacent metal layers

Semiconductor device and method of operating the same

Hybrid copper structure for advance interconnect usage

Hybrid copper structure for advance interconnect usage

Insulator void aspect ratio tuning by selective deposition

Interconnect structure and method for forming the same

Metal routing with flexible space formed using self-aligned spacer patterning

Methods for fabricating a low-resistance interconnect

Hybrid copper structure for advance interconnect usage

Metal routing with flexible space formed using self-aligned spacer patterning

Multi-metal fill with self-aligned patterning and dielectric with voids

Metal routing with flexible space formed using self-aligned spacer patterning

Metal line structure and method

Method of providing a workpiece including low resistance interconnect low-resistance interconnect

Semiconductor structure including low-resistance interconnect and integrated circuit device having the same

Semiconductor device and method of operating the same

Metal line structure and method

Interconnect structure and manufacturing method for the same

Multi-metal fill with self-aligned patterning and dielectric with voids

Multi-metal fill with self-aligned patterning and dielectric with voids

Interconnect structure and manufacturing method for the same

Metal line structure and method

Method for forming semiconductor device with damascene structure

Package structure and method for fabricating the same

Multiple pattern metal fuse device, layout, and method

Metal fuse structure by via landing

Interconnect structure and manufacturing method for the same

Split rail structures located in adjacent metal layers

Conductive element structure and method

Conductive element structure and method

Memory device, layout, and method

Metal line structure and method

Interconnection structure of semiconductor device

2-D interconnections for integrated circuits

QUANTA COMP INC

Server system and vibration-free extractable hard disc drive assembly thereof

Hard disc drive carrier

GLOBAL UNICHIP CORP

Dual mode analog to digital converter

Temperature sensing device and temperature sensing method

LIU HSIANG-WEI

Container data center

CHUANG WEN-HSIEN

Method of dynamic element matching and an apparatus thereof